5G Smartphone Packaging Market Size, Share, Opportunities, And Trends By Type (RF Front-End Module, Antenna In Package (AiP)), By Band (Sub-6 GHz, MmWave), And By Geography - Forecasts From 2024 To 2029

The global 5G smartphone packaging market is expected to grow at a CAGR of 12.03% from US$1,445.980 million in 2022 to US$3,203.132 million by 2029.

GROWTH DRIVERS

• Advancement in the radio frequency technology for the 5G Era

The advanced electronics packaging market has expanded significantly, driven by the demands of various sectors, particularly in radio frequency (RF) applications. The transition to 5G has necessitated larger silicon areas and increased power consumption in 5G smartphones to deliver enhanced wireless data rates compared to 4G. 5G-enabled chips are becoming larger and more feature-rich, creating competition for space within smartphones, particularly in relation to the limited battery space. As 5G and mmWave applications continue to grow, System-in-Package (SiP) solutions are becoming more intricate to maintain high-performance standards.

The rise of 5G mobile phones may lead to a fresh wave of smartphone replacements, propelling the industry chain towards a new phase of growth. In the coming years, with increasing 5G smartphones the market is anticipated to grow.

For instance:

• In December 2022, DuPont introduced CYCLOTENE™ Dry-Film Photo-Imageable Dielectric Material, aimed at enhancing advanced semiconductor packaging for high-performance applications such as 5G and AI. This development builds upon DuPont's extensive experience in integrating CYCLOTENE™ products into various applications, including RF dielectrics and redistribution layer (RDL) interposers within panels and advanced substrate packaging.

Antenna in package (AiP) technology driving 5G Expansion

The deployment of AiP and AoP technology is pivotal in providing fully integrated 5G NR millimeter wave (mmWave) and sub-6 GHz RF modules for smartphones and mobile devices. These mmWave antenna modules offer versatile capabilities across multiple spectrum bands while maintaining a compact form factor suitable for seamless integration into mobile devices. AiP/AoP technology enhances 5G signal integrity, addressing challenges through a phased antenna array design that minimizes the space needed to accommodate mmWave components within 5G devices.

In June 2022, TMY Technology Inc., a prominent mmWave solution provider and innovator, introduced its Antenna-in-Package (AiP) solutions tailored for 5G mobile and SATCOM applications. TMYTEK's AiP 5G mobile solution is geared for antenna design, validation, and production, focusing on 5G mmWave O-RAN RU across bands n257, n258, and n261. TMYTEK has established a comprehensive mmWave design, manufacturing, and testing ecosystem in collaboration with DuPont on a global scale, providing a one-stop-shop solution for these cutting-edge technologies.

Increasing Penetration of Smartphone Subscriptions

The rising use of smartphones and internet access, along with the ongoing trend, is driving the packaging market. Additionally, the consistent development of smartphone products leads to higher sales, a significant aspect of this market. New smartphones that provide better performance, biosensors, extended battery life, and increased AI capabilities, alongside the growing popularity of affordable smartphones in developing nations, will uplift the radio frequency and Antenna in Package (AiP) components sector. Consequently, the need for low-power ICs to extend battery life and shorten charging duration in smartphones is projected to boost the demand for 5G smartphone packaging.

According to the Ericsson Mobility Report 2023, data based on the country's Smartphone subscription subscriptions in 2021 and 2022 shows steady growth in various regions. Notable increases include North America, Western Europe, Latin America, the Middle East, and North Africa, reflecting a positive trend in smartphone adoption. China's substantial increase underscores its enduring dominance in the global smartphone market. These figures suggest a continued demand for mobile technology across diverse regions.

EMERGING OPPORTUNITIES IN THE 5G Smartphone Packaging Market

• Disruptive 5G packaging technologies

Simplifying design complexities in high-frequency devices, antenna integration within the package is introduced for 5G smartphones and millimeter-wave (mmWave) applications. The advent of 5G mmWave technology has brought about innovative packaging approaches, such as fan-out WLP5 and glass substrate interposers, which compete with advanced organic substrate flip-chip packages incorporating new low-loss dielectrics. Various packaging solutions using flip-chip and fan-out technology are explored for integrating antenna elements with RF components for 5G mmWave communication. Consulting delves deep into disruptive advanced packaging and RF electronics technologies, highlighting the latest innovations and potential business opportunities in the 5G market.

GEOGRAPHICAL PRESENCE

• In September 2023, Cana Limited (iCana), a wireless telecommunications semiconductor component supplier, unveiled its mmWave Beamforming IC (ICAMB2629-A) for n257 and n261 bands at the European Microwave Week 2023 Booth #546C in Berlin, Germany. The introduction of this Beamforming IC represents a significant achievement for iCana, aiming to revolutionize the 5G mmWave infrastructure market by providing a high-performance and cost-effective solution.
• In September 2023, Anritsu collaborates with MPI™ and ATV Systems to present cutting-edge 6G Antenna in Package (AiP) measurements at the European Microwave Week 2023 in Berlin. This solution incorporates a VectorStar™ VNA equipped with patented NLTL technology-based millimeter-wave (mmWave) extenders, allowing for sweeping measurements from 70 kHz to 220 GHz.

MAJOR PLAYERS IN THE MARKET

Several key players in the market, including Taiwan Semiconductor Manufacturing Company Limited, Qualcomm, Skyworks Solution Inc. and others, offer a wide range of product offerings, which encompass:

COMPANY NAME	PRODUCT NAME	DESCRIPTION
Taiwan Semiconductor Manufacturing Company Limited	N6RF	TSMC's cutting-edge N6RF technology, recognized as the most advanced RF CMOS solution, empowers our customers' products to achieve optimal 5G/Wi-Fi 6 & 6E performance while simultaneously enhancing battery life. This is achieved through its exceptional RF capabilities and the associated benefits of digital PPA (Power, Performance, and Area).
Qualcomm	RF Front End (RFFE)	Qualcomm Technologies' advanced RF front-end solutions are instrumental in empowering high-performance 5G multiband multimode smartphones and smart devices. These RF front-end (RFFE) micro-acoustic filter products consist of high-performance embedded and discrete components, such as duplexers, diplexers, extractors, and acoustic filters, including Qualcomm® ultraBAW and Qualcomm® ultraSAW filter technology, as well as SAW and TC-SAW filters.
Skyworks Solutions, Inc.	SKY58085-11	The SKY58085-11 module is meticulously designed to meet the demanding requirements of 5G NR and LTE advanced, especially when wider bandwidth (100 MHz) and carrier aggregation are essential for achieving higher data rates. This module efficiently combines filtering, RF matching, and TRx switching internally, enhancing performance for prevalent Downlink (DL) CA band combinations, all within a compact and cost-effective solution. It also provides support for very wide bandwidth 5G NR operations, suports up to 60 MHz of bandwidth.

 

5G Smartphone Packaging Market Scope:

 

Report Metric	Details
Market Size Value in 2022	US$1,445.980 million
Market Size Value in 2029	US$3,203.132 million
Growth Rate	CAGR of 12.03% from 2022 to 2029
Study Period	2019 to 2029
Historical Data	2019 to 2022
Base Year	2023
Forecast Period	2024 – 2029
Forecast Unit (Value)	USD Million
Segments Covered	Type Band Geography
Companies Covered	Taiwan Semiconductor Manufacturing Company Limited Qualcomm Murata Manufacturing Co., Ltd. Skyworks Solutions, Inc. Qorvo
Regions Covered	North America, South America, Europe, Middle East and Africa, Asia Pacific
Customization Scope	Free report customization with purchase

 

MARKET SEGMENTATION

• By Type
  • RF Front-End Module
  • Antenna in Package (AiP)
• By Band
  • Sub-6 GHz
  • mmWave
• By Geography
  • Americas
    • United States
    • Others
  • EMEA
    • Germany
    • UK
    • Others
  • APAC
    • China
    • Japan
    • South Korea
    • Others

---

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Market Segmentation

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Bandwidth Availability

4.4. Number of Users

5. GOVERNMENT REGULATIONS/POLICIES

6. 5G SMARTPHONE PACKAGING MARKET, BY TYPE 

6.1. Introduction

6.2. RF Front-End Module

6.3. Antenna in Package (AiP)

7. 5G SMARTPHONE PACKAGING MARKET, BY BAND

7.1. Introduction

7.2. Sub-6 GHz

7.3. mmWave

8. 5G SMARTPHONE PACKAGING MARKET, BY GEOGRAPHY

8.1. Introduction

8.2. Americas

8.2.1. United States

8.2.2. Others

8.3. Europe, Middle East and Africa

8.3.1. Germany

8.3.2. UK

8.3.3. Others

8.4. Asia Pacific

8.4.1. China

8.4.2. Japan

8.4.3. South Korea

8.4.4. Others

9. RECENT DEVELOPMENT AND INVESTMENTS

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

10.1. Major Players and Strategy Analysis

10.2. Vendor Competitiveness Matrix

11. COMPANY PROFILES

11.1. Taiwan Semiconductor Manufacturing Company Limited

11.2. Qualcomm

11.3. Murata Manufacturing Co., Ltd.

11.4. Skyworks Solutions, Inc.

11.5. Qorvo

11.6. TMY Technology, Inc.

Taiwan Semiconductor Manufacturing Company Limited

Qualcomm

Murata Manufacturing Co., Ltd.

Skyworks Solutions, Inc.

Qorvo

TMY Technology, Inc