Three-Dimensional Integrated Circuit Market Size, Share, Opportunities, COVID-19 Impact, And Trends By Technology (Monolithic, Wafer on Wafer, Die on Die), By Application (MEMS, Storage Devices, Sensors, Others), And By Geography - Forecasts From 2022 To 2027

The three-dimensional integrated circuit market is projected to grow at a compounded annual growth rate of 20.17% to reach a market size of US$26.451 billion by 2027, from US$7.308 billion in 2020. 3D integrated circuits (IC) are semiconductor metal oxide semiconductor (MOS) electronic devices constructed by stacking silicon dies or wafers vertically and connecting them through-silicon vias (TSVs) or copper connections (Cu-Cu), achieving performance improvements at lower power consumption with a smaller footprint compared to two-dimensional methods. Further, it has a high bandwidth and heterogeneous integration providing greater flexibility. Growing investment in R&D has been a strategic development of several companies. It has broadened the scope to the industry.  Further, with significant advancement of technology 3D IC will propel the 3DIC market. Increasing advent of artificial intelligence (AI), Internet of Things (IoT), wearable electronics, AR/VR and high performing computers, will be snowballing the demand for 3D IC.

Based on application, the three-dimensional integrated circuit market has been segmented as MEMS, storage device, sensors, and others. The sensor application was valued at US$XX billion in the year 2020 and is projected to grow at a CAGR of XX% to attain a market size of US$XX billion by 2027. A sensor is a device used to measure a property, such as pressure, position, temperature, or acceleration, and respond with feedback. Also known as transducers, sensors are one of the fundamental building blocks of modern data acquisition systems. They have a wide range of applications from flood & water level monitoring systems, environmental monitoring, traffic monitoring & controlling, energy saving in artificial lighting, remote system monitoring & equipment fault diagnostics, and precision agriculture & animal tracking. These diverse applications across several industry verticals like healthcare, automotive, and manufacturing industries among others are driving the market ahead in the current period. It makes the functioning of the sensor superior and better. Hence, the sensors market is projected to grow at an exponential rate, driving with it demand for 3-D IC. A 3-D IC in sensors gives the sensor a technological edge over a normal IC. Furthermore, the rise in IoT and superior demand for better screening and sensing technology is anticipated to expand the market demand at a significant pace.

Growing research and innovation in 3D IC is driving the market growth. Increasing adoption of innovative technology like AR/VR, Artificial Intelligence, IoT, and high-performing computers is propelling the use of 3D ICs. This is anticipated to grow with the fourth industrial revolution. Increasing R&D and innovation is a top priority for several companies to stay in the game. Companies are entering into strategic mergers and acquisitions to stay at the top of the game.  In February 2021, ASM Pacific Technology and EV Group entered into a joint development agreement (JDA) to Co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding is a crucial process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology. This technology combines chips with various process nodes to power new applications like 5G, high-performance computing (HPC), and artificial intelligence (AI). Further, increasing technology is also increasing the patent and copyrights, worldwide. In August 2022, GBT Technologies Inc. received an issue notification from the United States Patent and Trademark Office (USPTO) for its 3D, Multi-Planar IC design and manufacturing technology continuation patent application. This is the second patent application for its 3D, MP microchip architecture. The original innovation offered a novel approach to integrated circuit design and production that allows for the integration of cutting-edge analog, digital, and mixed-type ICs on a silicon wafer. The current patent aims in providing a design to reduce the cost, and energy and produce sophisticated microchips with higher performance, these techniques aim to make it possible to design and manufacture them on silicon with a smaller footprint. Such innovation and research are anticipated to significantly boost the market in the forecast period.

COVID-19 Impact on the Three-Dimensional Integrated Circuit Market

The COVID-19 pandemic is anticipated to have a positive effect on the three-dimensional integrated circuit market, however, it will restrain market expansion and impede it from growing to its full potential in 2020. Due to the disruption in supply chains and delays in production operations, the COVID-19 pandemic slowed down the growth of the three-dimensional integrated circuit industry in 2020. However, the pandemic had a substantial impact on a number of businesses while also catalyzing overall ICT development. According to the Semiconductor Industry Association (SIA) in February 2021, the global semiconductor sector recorded a growth of 6.5% in sales, reaching US$439.0 billion in 2020, up from US$412.3 billion in 2019. Moreover, the shipments of silicon wafer area around the world surged in 2020. According to the SEMI Silicon Manufacturers Group, the number of silicon exports increased by 5% year over year to a total of 12,407 MSI, compared to the 11,810 million square inches (MSI) sold in 2019.

Following the pandemic, a number of manufacturing companies started to increase the manufacture of a number of new gadgets. The expansion in manufacturing initiatives is anticipated to raise demand for 3D IC technologies. For instance, Taiwan Semiconductor Manufacturing Company (TSMC) continued to work on 3D IC technologies and announced TSMC 3DFabricTM in 2020, a full unit that includes both backend enhanced packaging technologies and frontend 3D chip stacking.

In the short-run, the CAGR of the non-COVID-19 scenario is projected to outrun the COVID-19 CAGR, reaching a high of 18.63% from 2019 to 2023. However, in the long run, the COVID-19 market is projected to catch up with a CAGR of 19.06% and outrun the non-COVID-19 long-run CAGR projected at 18.98% from 2023 to 2027. The market is further expected to outgrow itself in the COVID-19 scenario.

Three-Dimensional Integrated Circuit Market Scope:

 

Report Metric	Details
Market Size Value in 2020	US$7.308 billion
Market Size Value in 2027	US$26.451 billion
Growth Rate	CAGR of 20.17% from 2020 to 2027
Base Year	2020
Forecast Period	2022–2027
Forecast Unit (Value)	USD Billion
Segments Covered	Technology, Application, And Geography
Regions Covered	North America, South America, Europe, Middle East and Africa, Asia Pacific
Companies Covered	Taiwan Semiconductor Manufacturing Company, Invensas Corporation, Amkor Technology Inc., Xilinx, Inc., Tezzaron Semiconductor Corporation, Aveni Inc., JCET Group, STMicroelectronics, Advanced Semiconductor Engineering Inc. (ASE), IBM
Customization Scope	Free report customization with purchase

 

Segmentation

• By Technology
  • Monolithic
  • Wafer on Water
  • Die on Wafer
  • Die on Die
• By Application
  • MEMS
  • Storage Device
  • Sensors
  • Others
• By Geography
  • North America
    • USA
    • Canada
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Spain
    • Others
  • Middle East and Africa
    • Israel
    • Saudi Arabia
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • Australia
    • South Korea
    • Taiwan
    • Thailand
    • Indonesia
    • Others

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1. INTRODUCTION

1.1. Market Overview

1.2. Covid-19 Scenario

1.3. Market Definition

1.4. Market Segmentation

 

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

 

3. EXECUTIVE SUMMARY

3.1. Research Highlights

 

4. MARKET DYNAMICS

4.1. Market Driver

4.2. Market Restraints

4.3. Porters Five Forces Analysis

4.3.1. Bargaining Power of End-Users

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

 

5. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET, BY TECHNOLOGY

5.1. Introduction

5.2. Monolithic

5.3. Wafer on Water

5.4. Die on Wafer

5.5. Die on die

 

6. THREE-DIMENSIONAL INTEGRATED CIRCUIT  MARKET, BY APPLICATION

6.1. Introduction

6.2. MEMS

6.3. Storage Devide

6.4. Sensors

6.5. Others

 

7. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET,  BY GEOGRAPHY

7.1. Introduction 

7.2. North America

7.2.1. USA

7.2.2. Canada

7.2.3. Mexico

7.3. South America

7.3.1. Brazil

7.3.2. Argentina

7.3.3. Others

7.4. Europe

7.4.1. UK

7.4.2. Germany

7.4.3. France

7.4.4. Italy 

7.4.5. Spain

7.4.6. Others

7.5. Middle East And Africa

7.5.1. Israel 

7.5.2. Saudi Arabia

7.5.3. Other

7.6. Asia Pacific

7.6.1. China

7.6.2. Japan

7.6.3. India

7.6.4. Australia

7.6.5. South Korea

7.6.6. Taiwan

7.6.7. Thailand

7.6.8. Indonesia

7.6.9. Others

 

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

8.1. Major Players and Strategy Analysis

8.2. Emerging Players and Market Lucrativeness

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Vendor Competitiveness Matrix

 

9. COMPANY PROFILES

9.1. Taiwan Semiconductor Manufacturing Company 

9.2. Invensas Corporation

9.3. Amkor Technology Inc. 

9.4. Xilinx, Inc.

9.5. Tezzaron Semiconductor Corporation

9.6. Aveni Inc. 

9.7. JCET Group

9.8. STMicroelectronics

9.9. Advanced Semiconductor Engineering Inc. (ASE)

9.10. IBM

Taiwan Semiconductor Manufacturing Company

Invensas Corporation

Amkor Technology Inc.

Xilinx, Inc.

Tezzaron Semiconductor Corporation

Aveni Inc.

JCET Group

STMicroelectronics

Advanced Semiconductor Engineering Inc. (ASE)

IBM