The semiconductor bonding material market is projected to increase at a CAGR of 5.25% over the forecast period between 2025 and 2030.
The semiconductor is a material with essential electrical properties that make it useful for manufacturing computers and electronic equipment. Additionally, it is a chemically solid substance that, under certain circumstances, conducts electricity. Defense equipment, communication systems, transportation, computing, healthcare, and renewable energy are a few of the lucrative semiconductor applications. Atoms are bonded together in semiconductor arrangements to create a huge number of integrated circuits and production tools. The semiconductor bonding model has a uniform and constant semiconductor material structure.
This bonding material market is a vital component of the semiconductor industry and is responsible for connecting various device parts. The market is growing due to the increasing demand for advanced electronic devices like smartphones, electric vehicles, and IoT devices. Packaging technology advancements, 5G adoption, and R&D investments contribute to market expansion.
The semiconductor bonding material market growth will be accelerated by rising interest in electric vehicles and micro-electromechanical systems. The number of linked devices that use stacked die systems will expand the size of the global semiconductor bonding industry. Launching the 5G network and increasing research in developing the 6G network will aid in the semiconductor bonding market's rapid global expansion. The use of smartphones and wearable technology will increase, boosting worldwide market trends. In addition, the market is also anticipated to grow in the coming years due to the numerous uses for semiconductors in linked logistics, architecture & home automation, smart transportation, and smart transport.
The semiconductor bonding market is expanding due to the growing use of stacked dies technology in IoT devices. Using the same placement area on a substrate for numerous functionalities is possible by stacking one bare die on top of another inside a single semiconductor package. Die stacking improves electrical device performance by speeding up signal creation through shorter routing of links between circuits. Original equipment producers (OEMs) in the semiconductor sector are concentrating on using the IoT's advantages outside of connection, significantly fuelling the semiconductor bonding material market growth.
One of the main factors driving the expansion of the semiconductor wafer bonding market is the semiconductor industry's rising demand for thin wafers. Developments in thin wafers have overcome many outdated fabrication techniques. Thin wafer manufacturing has advantages, including ultra-low power consumption and ultra-high electrical performance, which is drawing interest from Chinese IC makers who want to capitalize on this technology.
Many Chinese IC suppliers are driven primarily by the requirement for thin chips with great performance at low operating voltage and low cost. As a result, wafer bonding and other thin wafer technologies are becoming increasingly common among Chinese IC producers like Hisilicon Technologies, Co., Ltd., Spreadtrum Communications, and RDA Microelectronics.
To complete die-attach procedures, semiconductor bonding equipment needs a lot of input power. These devices need anywhere from a few hundred to a few thousand watts of power. Due to intricate, expensive components, semiconductor bonding equipment has a very high manufacturing cost. It is also expensive to assemble several large and small pieces, such as the screen, bonding hand, hoover, sensors, and heat source. As a result, die bonder equipment's overall manufacturing and ownership expenses for semiconductor bonding equipment are quite expensive. The market's expansion is further hampered by the high cost of semiconductor wafers, which raises the operating expense of semiconductor bonding.
Die bonder equipment uses mechanical motions to pick and position the die for the bonding process. The machinery has many moving pieces that must be moved carefully to connect the die to the substrate precisely. However, occasionally, the joints' irregular motion and other problems, such as instability, might cause the moving parts to vibrate. Die misalignment or die cracking can be caused by the vibration in the die bonders. The vibration of mechanical components has grown to be a significant obstacle that makers of semiconductor bonding equipment must overcome.
Geography-wise, the semiconductor bonding material market is divided into the Americas, Europe, the Middle East and Africa, and the Asia Pacific. The Asia-Pacific region is anticipated to hold the semiconductor bonding materials market share during the projected period due to strategic investments made by important domestic suppliers and the well-established semiconductor industry, which is a big player in the market. The area is home to some of the biggest semiconductor companies, and increasing investments are being made to support the sector's infrastructure in countries like China, India, and Vietnam. Additionally, reputable domestic vendors and governmental organizations are investing heavily in technology to provide future semiconductor bonding solutions, like hybrid bonding, which is anticipated to boost market expansion during the projected period.
| Report Metric | Details |
|---|---|
| Study Period | 2021 to 2031 |
| Historical Data | 2021 to 2024 |
| Base Year | 2025 |
| Forecast Period | 2026 – 2031 |
| Report Metric | Details |
| Growth Rate | CAGR of 5.25% |
| Study Period | 2020 to 2030 |
| Historical Data | 2020 to 2023 |
| Base Year | 2024 |
| Forecast Period | 2025 – 2030 |
| Forecast Unit (Value) | USD Billion |
| Segmentation |
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| Geographical Segmentation | Americas, Europe, Middle East and Africa, Asia Pacific |
| List of Major Companies in Semiconductor Bonding Material Market |
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| Customization Scope | Free report customization with purchase |