Semiconductor Advanced Substrate Market Size, Share, Opportunities, And Trends By Type (Advanced IC Substrate (FC BGA, FC CSP), Substrate-like-PCB (SLP), Embedded Die), By Application (Consumer Electronics, Automotive And Transportation, IT And Telecom, Others), And By Geography - Forecasts From 2023 To 2028

The global semiconductor advanced substrate market is expected to grow at a CAGR of 8.65% during the forecast period between 2025 and 2030.

The printed circuit boards (PCBs) and semiconductor chips are connected by an advanced semiconductor substrate, which serves as a baseboard. It has great heat dissipation performance and is cost-effective, strong, lightweight, and energy-efficient. Additionally, it boosts PCB functionality and dimensional control, reduces overall PCB weight, and offers excellent dependability and exceptional electrical qualities. Because of this, it is now commonly employed to create miniaturized electrical goods with the newest features.

Further, as the demand for high-end smartphones continues to expand significantly, the semiconductor advanced substrate market has experienced tremendous expansion.

What are the Semiconductor Advanced Substrate Market Drivers?

• Rising demand for miniaturization trends in the semiconductor industry is driving the market expansion.

The semiconductor advanced substrate market is primarily pushed by the rapid technological advancements that have made buying things for several uses on a single platform feasible. The growth of computing, networking, communications, and consumer electronics has increased the demand for small, dependable semiconductor devices. This has driven the need for the materials required to make high-performance semiconductor components. Portable electronic equipment likewise requires smaller, thinner packaging strategies for savings in space and expenses. Due to highly integrated, fast-moving applications like aerospace and some consumer electronics, improving electrical performance to lessen noise consequences is particularly essential.

• Increasing usage in manufacturing IOT equipment is expected to boost the market.

Due to the increasing adoption of technology in both the consumer and industrial sectors, there is a growing need for loT on a global scale. Because of the rising demand, vendors are producing chipsets tailored specifically for loT. The market players include Altair, Huawei, Intel, Qualcomm, Samsung, Sierra, and many other top loT chipset producers. Due to the increasing number of loT devices, the demand for the chips used in developing loT devices is predicted to increase throughout the estimated time. Along with chip downsizing, the innovation in reducing energy consumption will be a primary priority for manufacturers, significantly fueling the semiconductor advanced substrate market growth.

• Increased research and development to aid market growth globally.

The elements used for creating the final products have increased the significance of IC packaging in developing electronic systems. Due to the demand from semiconductor IC producers to devote more to research and development to make ICs smaller and more efficient, tiny electro-mechanical systems (MEMS) and 3D chip packaging have emerged, creating potential opportunities for the advanced IC substrate industry.

• Growing demand for consumer electronics is anticipated to boost the market’s growth.

Mobile and consumer electronics manufacturers are being compelled to develop smaller, more portable items by the demand for mobile phones and consumer electronics. The expanding miniaturization trend is driving the demand for sophisticated packaging.

Some key elements projected to significantly influence the adoption of advanced IC substrates during the forecast period include the increased functionality of mobile devices and consumer electronics items and the rising popularity of smart gadgets and smart wearables. The growing uptake of advanced technologies like AI, HPC, and high-performance mobile devices drives the need for sophisticated substrates.

What are the Semiconductor Advanced Substrate Market Challenges?

• The complexity of the process could hinder the semiconductor advanced substrate market growth.

The IC substrate is thin and easily deformed when a board is thinner than 0.2 mm, especially in projecting circumstances. To manage substrate warpage and lamination thickness and overcome the difficulties, advancements in board shrinking, lamination parameters, and layer positioning technologies are needed. It is also difficult because of the costs involved in upholding ideal levels of thermal, electrical, and physical limits.

Despite their benefits, the highest I/O abilities, and substrate flexibility for diverse performance needs, flip chips have not shown to be a cost-effective packaging approach. When assembly costs are taken into account, flip-chip packaging becomes a costly option. These factors hinder the semiconductor advanced substrate market size.

The Semiconductor Advanced Substrate Market is segmented into five regions worldwide:

Geography-wise, the semiconductor advanced substrate market is divided into the Americas, Europe, the Middle East and Africa, and Asia Pacific. The Asia-Pacific region is anticipated to hold a considerable share of the semiconductor advanced substrate market during the projected period. Taiwan occupies a significant percentage of the market share because of the sheer number of producers and the growing amount of money invested in the country's semiconductor industry. Some important manufacturers, including ASE Group, Unimicron, and Kinsus, have their headquarters in Taiwan and have brisk production rates. From upstream design through downstream IDM and IC packaging and testing, as well as a skilled division of labor, the IC sector in Taiwan has a complete supply chain. The SG implementation has also spread more widely across the country. For instance, Chunghwa Telecom Co., Ltd. announced its plans to accelerate the 5G base station development in Taiwan and achieve a 96% population coverage nationwide.

Moreover, key developments from regional manufacturers are expected to boost the regional market in the coming years. For instance, In February 2023, Samsung Electro-Mechanics expanded the spectrum of chip products that can be utilized in autos by developing an automotive semiconductor package on an FC BGA substrate, especially for driving assistance systems. Its flip-chip ball grid array (FCBGA) can be employed with advanced driver assistance systems (ADAS), one of the most technically challenging automotive semiconductor substrates to produce.

Semiconductor Advanced Substrate Market Key Developments:

• In November 2024, CHIPS for America announced up to $300 million in funding to enhance U.S. semiconductor packaging, with each investment expected to reach $100 million. The funding focuses on advanced substrates, enabling seamless assembly of multiple semiconductor chips, high-bandwidth communication, efficient power delivery, and heat dissipation.
• In October 2024, KLA Corporation introduced a comprehensive IC substrate portfolio, offering a wide range of process control and enabling advanced semiconductor packaging solutions for IC substrate manufacturing. Their expertise in front-end semiconductors, packaging, and IC substrates will help customers achieve breakthroughs in packaging interconnect density for high-performance applications.

The Semiconductor Advanced Substrate Market is segmented and analyzed as follows:

• By Type
  • Advanced IC Substrate
  • FC BGA
  • FC CSP
  • Substrate-like-PCB
  • Embedded Die
• By Packaging Type
  • System in Package(SiP)
  • Quad Flat Package (QFP)
  • Ball Grid Array (BG)
  • Chip Scale Packaging( CSP)
  • Others
• By Application
  • Consumer Electronics
  • Automotive and Transportation
  • IT and Telecom
  • Others
• By Geography
  • Americas
    • US
  • Europe, the Middle East, and Africa
    • Germany
    • Netherlands
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

---

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base and Forecast Years Timeline

1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY  

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. The Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY TYPE

5.1. Introduction

5.2. Advanced IC Substrate

5.2.1. FC BGA

5.2.2. FC CSP

5.3. Substrate-like-PCB (SLP)

5.4. Embedded Die

6. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY PACKAGING TYPE

6.1. Introduction

6.2. System in Package (SiP) 

6.3. Quad Flat Package (QFP)

6.4. Ball Grid Array (BG) 

6.5. Chip Scale Packaging (CSP) 

6.6. Others

7. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY APPLICATION

7.1. Introduction

7.2.  Consumer Electronics

7.3. Automotive and Transportation

7.4. IT and Telecom

7.5. Others

8. SEMICONDUCTOR ADVANCED SUBSTRATE MARKET BY GEOGRAPHY

8.1. Global Overview

8.2. Americas

8.2.1. US

8.3. Europe, Middle East, and Africa

8.3.1. Germany

8.3.2. Netherlands

8.3.3. Others

8.4. Asia-Pacific

8.4.1. China

8.4.2. Japan

8.4.3. Taiwan

8.4.4. South Korea

8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. ASE Group

10.2. Fujitsu Limited

10.3. Ibiden Co. Ltd.

10.4. Kinsus Interconnect Technology Corp.

10.5. Korea Circuit Co. Ltd.

10.6. KYOCERA Corporation

10.7. LG Innotek Co. Ltd.

10.8. Nan Ya PCB Co. Ltd.

10.9. TTM Technologies Inc.

10.10. Unimicron Technology Corporation

ASE Group

Fujitsu Limited

Ibiden Co. Ltd.

Kinsus Interconnect Technology Corp.

Korea Circuit Co. Ltd.

KYOCERA Corporation

LG Innotek Co. Ltd.

Nan Ya PCB Co. Ltd.

TTM Technologies Inc.

Unimicron Technology Corporation