Outsourced Semiconductor Assembly And Test Services (OSAT) Market Size, Share, Opportunities, And Trends By Service Type (Packaging, Testing), By Packaging Type (Ball Grid Array (BGA) Packaging, Chip-scale Packaging (CSP), Stacked Die Packaging, Multi-chip Packaging, Quad Flat And Dual-inline Packaging), By Application (Communication, Consumer Electronics, Automotive, Computing And Networking, Industrial, Others), And By Geography - Forecasts From 2024 To 2029

OSAT Market Size: 

The outsourced semiconductor assembly and test services (OSAT) market is projected to rise at a compound annual growth rate (CAGR) of 15.93% to reach a market valuation of US$73,174.562 million by 2029, from US$25,999.486 million in 2022.

Outsourced semiconductor assembly and test services is the industry term for the provision of specialist manufacturing and testing services to semiconductor businesses. To assemble, package, and test integrated circuits (ICs) and other semiconductor devices, semiconductor manufacturers employ OSAT companies. The rising demand for cutting-edge electronic gadgets across a range of sectors is driving the OSAT market. OSAT suppliers conduct assembly and testing for semiconductor businesses to save money and expedite delivery. Furthermore, the need for specialized OSAT services is driven by complex semiconductor components such as SoC designs and improved packaging methods.

OSAT Market Growth Drivers

• Growing Demand for Miniaturization: Ongoing research and development has led to the creation of new products, manufacturing processes, and semiconductor designs, all of which have accelerated the industry's growth. In September 2023, for instance, the US National Science Foundation declared that it would provide $45.6 million in support for 24 research and teaching programs, including funds from the "CHIPS and Science Act of 2022." These programs aim to accelerate advancements in semiconductor technology, production, and workforce development.

Furthermore, end-use semiconductor sales in 2021 experienced a significant rise as a result of the industry's persistent efforts to accommodate the rising demand for semiconductors. As more employment moved to remote work and home learning, sales of end-use categories like PCs saw notable growth. Other areas, including the automotive sector, had sharp rises all year long and eventually acquired market share in 2021, making it the third-largest semiconductor end-use market. This growth in the end-use of semiconductors significantly boosts the Outsourced semiconductor assembly and test services (OSAT) market expansion.

OSAT Market Geographical Outlook:

• The OSAT market is projected to grow in the Asia Pacific region.

OSAT development is further aided by the globalization of the semiconductor sector, particularly in the Asia-Pacific region.

China, Taiwan, and South Korea are becoming important centers for the assembly and production of semiconductors. OSAT suppliers shorten product time-to-market by providing experience in the assembly, packaging, and testing procedures.

Furthermore, the Semiconductor Industry Association reports that China's semiconductor industries are spending a lot of money on capital expenditures (CAPEX), which are monies used by businesses to purchase, renovate, or maintain their assets. Chinese CAPEX firms invested US$ 12.3 billion in 2021 and US$ 15.3 billion in 2022. The semiconductor manufacturing is expected to be driven by the rising need for production facilities as well as the growing requirement for semiconductors in the automotive and consumer electronics industries, which in turn upsurges the demand for OSAT globally.

OSAT Semiconductor Market Analysis:

OSAT (Outsourced Semiconductor Assembly and Test) refers to a third-party semiconductor package, assembly, and test outsourcing for IDMs (Integrated Device Manufacturers) and fabless companies. OSATs carry out important post-fabrication processes to guarantee chips of desired performance, reliability, and quality. With the growing need for advanced packaging (e.g., 2.5D/3D IC, fan-out), OSATs facilitate cost-saving scaling for AI, 5G, and automotive electronics markets. Major OSAT market players include ASE Group, Amkor Technology, and JCET, controlling the $73,174M+ global OSAT market. With growing chip complexity, OSATs become a critical enabler of time-to-market compression and supply chain bottleneck relief.

OSAT Market Key Market Developments:

• December 2023, a reputable Outsourced Semiconductor Assembly and Test (OSAT) company placed an order with Camtek Ltd. for 25 systems for a range of advanced packaging applications.

OSAT Market Key Players:

• ASE Group is a leading provider of global semiconductor testing services globally. The company is involved in various stages of the semiconductor manufacturing process, such as wafer probing, IC package design, front-end engineering test, and substrate design, among others. It offers advanced semiconductor supply chain services in collaboration with its sister company, USI.
• Amkor Technology Inc. is one of the world's largest providers of outsourced semiconductor packaging, design, and test services. It offers an extensive array of test capabilities in device testing and is regarded as a top OSAT supplier for automotive and artificial intelligence processor testing as well.
• Powertech Technology Inc. is a major company delivering key OSAT solutions such as final testing, IC packaging, and module assembly, among others. The company is building new strategic partnerships to deliver unique technological insights and solutions.

OSAT Market Scope:

Report Metric	Details
OSAT Market Size in 2024	US$25,999.486 million
OSAT Market Size in 2029	US$73,174.562 million
Growth Rate	CAGR of 15.93%
Study Period	2019 to 2029
Historical Data	2019 to 2022
Base Year	2024
Forecast Period	2024 – 2029
Forecast Unit (Value)	USD Million
Segmentation	Service Type Packaging Type Application Geography
Geographical Segmentation	Americas, Europe Middle East and Africa, Asia Pacific
List of Major Companies in OSAT Market	Amkor Technology Inc. Powertech Technology Inc. ChipMOS Technologies Inc. King Yuan Electronics Co. Ltd UTAC Holdings Ltd
Customization Scope	Free report customization with purchase

 

OSAT Market is segmented and analyzed as follows:

• By Service Type:
  • Packaging
  • Testing
• By Packaging Type:
  • Ball Grid Array (BGA) Packaging
  • Chip-scale Packaging (CSP)
  • Stacked Die Packaging
  • Multi-Chip Packaging
  • Quad Flat and Dual-inline Packaging
• By Application:
  • Communication
  • Consumer Electronics
  • Automotive
  • Computing and Networking
  • Industrial
  • Others
• By Geography
  • Americas
    • US
  • Europe Middle East and Africa
    • Germany
    • Netherlands
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

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1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

3.2. Analyst View

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY SERVICE TYPE

5.1. Introduction

5.2. Packaging

5.2.1. Market Trends and Opportunities

5.2.2. Growth Prospects

5.2.3. Geographic Lucrativeness

5.3. Testing

5.3.1. Market Trends and Opportunities

5.3.2. Growth Prospects

5.3.3. Geographic Lucrativeness

6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY PACKAGING TYPE

6.1. Introduction

6.2. Ball Grid Array (BGA) Packaging

6.2.1. Market Trends and Opportunities

6.2.2. Growth Prospects

6.2.3. Geographic Lucrativeness

6.3. Chip-scale Packaging (CSP)

6.3.1. Market Trends and Opportunities

6.3.2. Growth Prospects

6.3.3. Geographic Lucrativeness

6.4. Stacked Die Packaging

6.4.1. Market Trends and Opportunities

6.4.2. Growth Prospects

6.4.3. Geographic Lucrativeness

6.5. Multi-Chip Packaging

6.5.1. Market Trends and Opportunities

6.5.2. Growth Prospects

6.5.3. Geographic Lucrativeness

6.6. Quad Flat and Dual-inline Packaging

6.6.1. Market Trends and Opportunities

6.6.2. Growth Prospects

6.6.3. Geographic Lucrativeness

7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY APPLICATION

7.1. Introduction

7.2. Communication

7.2.1. Market Trends and Opportunities

7.2.2. Growth Prospects

7.2.3. Geographic Lucrativeness

7.3. Consumer Electronics

7.3.1. Market Trends and Opportunities

7.3.2. Growth Prospects

7.3.3. Geographic Lucrativeness

7.4. Automotive

7.4.1. Market Trends and Opportunities

7.4.2. Growth Prospects

7.4.3. Geographic Lucrativeness

7.5. Computing and Networking

7.5.1. Market Trends and Opportunities

7.5.2. Growth Prospects

7.5.3. Geographic Lucrativeness

7.6. Industrial

7.6.1. Market Trends and Opportunities

7.6.2. Growth Prospects

7.6.3. Geographic Lucrativeness

7.7. Others

7.7.1. Market Trends and Opportunities

7.7.2. Growth Prospects

7.7.3. Geographic Lucrativeness

8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST SERVICES (OSAT) MARKET BY GEOGRAPHY

8.1. Introduction

8.2. Americas

8.2.1. US

8.3. Europe Middle East and Africa

8.3.1. Germany

8.3.2. Netherlands

8.3.3. Others

8.4. Asia-Pacific

8.4.1. China

8.4.2. Japan

8.4.3. South Korea

8.4.4. Taiwan

8.4.5. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Market Share Analysis

9.3. Mergers, Acquisition, Agreements, and Collaborations

9.4. Competitive Dashboard

10. COMPANY PROFILES

10.1. ASE Group (ASE Technology Holdings)

10.2. Amkor Technology Inc.

10.3. Powertech Technology Inc.

10.4. ChipMOS Technologies Inc.

10.5. King Yuan Electronics Co. Ltd

10.6. Jiangsu Changjiang Electronics Technology Co. Ltd

10.7. UTAC Holdings Ltd

10.8. Lingsen Precision Industries Ltd

10.9. Tongfu Microelectronics Co.

OSAT Companies:

• ASE Group (ASE Technology Holdings)
• Amkor Technology Inc.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• King Yuan Electronics Co. Ltd
• Jiangsu Changjiang Electronics Technology Co. Ltd
• UTAC Holdings Ltd
• Lingsen Precision Industries Ltd
• Tongfu Microelectronics Co.