Global Electronic Adhesives Market Size, Share, Opportunities, And Trends By Type (Electrically conductive adhesives, Thermally conductive adhesives, Ultraviolet-curing adhesives, Others), By Application (Chip bonding, Wire tacking, Potting and encapsulation, Conformal coatings), By Industry Vertical (Telecommunications, Automotive, Consumer Electronics, Defense, Others), And By Geography - Forecasts From 2023 To 2028

The global Electronic adhesives market is projected to expand at a CAGR of 13.25% over the forecast period. The use of adhesives in electronics is widespread and is used not only in the manufacturing of electronic commodities but also in maintaining the long-term operation of these products. PCB or Printed Circuit Board is the building block of the electronics industry where the use of adhesives is required for bonding surface mount components, wire tacking or fixing, and also in the encapsulation of the components. The increasing use of electronic adhesives across various industry verticals including telecommunications, consumer electronics, automotive, and many more is driving the market growth. Also, the increasing use of consumer electronics, one of the major contributors in promoting the growth of the electronics industry is further fueling the growth of the global electronic adhesives market.

 

Region-wise, North America is expected to hold the major market share while the Asia Pacific is considered the fastest-growing market due to the growing electronics industry in countries like India and China.

 

The Dow Chemical Company, a Midland Michigan-based company has an industry-leading portfolio of specialty chemicals and advanced materials delivering more than 6000 technology-based product families to their customers in around 180 countries across all high-growth sectors which include packaging, electronics, water, coatings, and agriculture. The company’s leading portfolio of silicone die-to-attach adhesives delivers proven and dependable bonds in most of the chip-demanding applications in automotive, communications, consumer electronics, and industrial markets. DOW CORNING™ die-attach adhesives are solventless, environmentally responsible products that cure at a range of temperatures reducing thermal stress and energy consumption.

 

Major industry players profiled as part of the report are 3M, H.B. Fuller, Master Bond Inc, LG Chem, and Henkel Corporation among others.

 

The global Electronic adhesives market has been analyzed through the following segments:

 

 

 

 

 

 

 

 

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Currency

1.5. Assumptions

1.6. Base, and Forecast Years Timeline

2.1. Research Design

2.2. Secondary Sources

4.1. Market Segmentation

4.2. Market Drivers

4.3. Market Restraints

4.4. Market Opportunities

4.5. Porter’s Five Force Analysis

4.5.1. Bargaining Power of Suppliers

4.5.2. Bargaining Power of Buyers

4.5.3. Threat of New Entrants

4.5.4. Threat of Substitutes

4.5.5. Competitive Rivalry in the Industry

4.6. Life Cycle Analysis - Regional Snapshot

4.7. Market Attractiveness

5.1. Electrically conductive adhesives

5.2. Thermally conductive adhesives

5.3. Ultraviolet-curing adhesives

5.4. Others

6.1. Chip bonding

6.2. Wire tacking

6.3. Potting and encapsulation

6.4. Conformal coatings

7.1. Telecommunications

7.2. Automotive

7.3. Consumer electronics

7.4. Defense

7.5. Others

8.1. North America

8.1.1. United States

8.1.2. Canada

8.1.3. Mexico

8.1.4. Others

8.2. South America

8.2.1. Brazil

8.2.2. Argentina

8.2.3. Others

8.3. Europe

8.3.1. Germany

8.3.2. France

8.3.3. Italy

8.3.4. United Kingdom

8.3.5. Others

8.4. Middle East and Africa

8.4.1. Israel

8.4.2. Saudi Arabia

8.4.3. UAE

8.4.4. Others

8.5. Asia Pacific

8.5.1. Japan

8.5.2. China

8.5.3. India

8.5.4. Australia

8.5.5. South Korea

8.5.6. Others

9.1.  Market Share Analysis

9.2.  Recent Deals and Investment 

9.3. Strategies of Key Players

10.1. DELO Industrie Klebstoffe GmbH & Co. KGaA

10.1.1. Company Overview

10.1.2. Financials

10.1.3. Products and Services

10.1.4. Recent Developments

10.2.  3M

10.2.1. Company Overview

10.2.2. Financials

10.2.3. Products and Services

10.2.4. Recent Developments

10.3.  H.B. Fuller

10.3.1. Company Overview

10.3.2. Financials

10.3.3. Products and Services

10.3.4. Recent Developments

10.4.  Henkel Corporation

10.4.1. Company Overview

10.4.2. Financials

10.4.3. Products and Services

10.4.4. Recent Developments

10.5. Master Bond Inc.

10.5.1. Company Overview

10.5.2. Financials

10.5.3. Products and Services

10.5.4. Recent Developments

10.6. LG Chem

10.6.1. Company Overview

10.6.2. Financials

10.6.3. Products and Services

10.6.4. Recent Developments

10.7. The Dow Chemical Company

10.7.1. Company Overview

10.7.2. Financials

10.7.3. Products and Services

10.7.4. Recent Developments

10.8. Avery Dennison Corporation

10.8.1. Company Overview

10.8.2. Financials

10.8.3. Products and Services

10.8.4. Recent Developments

10.9. Wacker Chemie AG

10.9.1. Company Overview

10.9.2. Financials

10.9.3. Products and Services

10.9.4. Recent Developments

10.10. Kohesi Bond

10.10.1. Company Overview

10.10.2. Financials

10.10.3. Products and Services

10.10.4. Recent Developments

LIST OF FIGURES

LIST OF TABLES

DISCLAIMER