Flip Chip Technology Market Size, Share, Opportunities, And Trends By Technology (Ball Grid Array, Chip Scale Package), By Bumping Technology (Copper Pillar, Gold Stud Bumping, Lead-Free Solder, Tin-Lead Eutectic Solder), By Application (Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, Others), And By Geography - Forecasts From 2023 To 2028

One of the first and most used methods for semiconductor packaging is flip-chip technology. IBM first released the flip chip 30 years ago. Yet, it is evolving to support cutting-edge technologies like 2.5D and 3D by creating new bumping solutions. Traditional applications including laptops, desktops, CPU, GPU, chipsets, etc. employ flip chips.

The flip-chip is one of the main driving forces for 3D integration and more so than the Moore method, since it helps to allow complex SoC. (system on chip). The market is expanding as a result of the rapid expansion of MMICs (monolithic microwave IC), which are appliances that function at microwave frequencies (300 MHz to 300 GHz). Embedded die and fan-out wafer-level packaging are two of the market's quickest-emerging technologies. Also, a few well-known suppliers are growing their use of these technologies by investing more in them.

The development of the portable electronics market, the rise in popularity of the Internet of Things (IoT), the need for circuit miniaturization in microelectronic devices, technological superiority over wire bonding, the higher cost & fewer customization options available in comparison to wired bonding, and the need for high-frequency data transmission are the key factors influencing the growth of the global flip chip market. The development of the overall flip chip market is, nevertheless, predicted to be significantly impacted by each of these aspects throughout the forecast period.

The military and defense sector will fuel market expansion.

Contemporary military and defense settings demand technologies that are tried and true, dependable, and scalable. As they offer solutions for the whole defense ecosystem, including complicated controls, measurements, monitoring, and execution, sensors are a crucial component of the technologies. The need for flip-chip technology in military computing platforms is being driven by the ongoing increase in the sensor content of military systems. The components of packing and assembly are essential to the execution of any radar. Cost is crucial as radar applications multiply. Cost and packaging are being taken into consideration for millimeter-wave automobiles and UAVs. Radars using a single chip and T/R modules with several channels are becoming practical. For instance, a SiGe transmit-receive phased-array device operating at 76 to 84 GHz has been created for car radar applications.

The development of copper pillars and micro bumping is propelling market expansion.

Due to improvements in the copper pillar and micro bumping metallurgy, which are widely used in several applications including consumer electronics and mobile phones, the need for flip chip technology is now high. The copper pillar bumping method is compatible with the most cutting-edge manufacturing processes and is adaptable to new problems. The next-generation flip-chip connection, known as copper pillar bump, has features that will help it satisfy future requirements for electronic devices. The market for flip-chip technology is expanding due to rising demand for mobile phones, computers, and consumer applications.

Asia Pacific is projected to be the prominent market shareholder in the global flip-chip technology market and is anticipated to continue throughout the forecast period.

The Asia Pacific region still dominates the world market for flip-chip technology. It is projected that this trend will continue for the anticipated amount of time given the plethora of fabrication facilities and the significant research and development being carried out by significant companies like TSMC Ltd. and Fujitsu. Asia Pacific countries with the highest production and consumption of personal electronic gadgets include Japan, China, and South Korea. Significant growth is projected in China's packaging market throughout the projection period. The rising demand for IC components has led to a rise in the adoption of complex packaging techniques that enable higher degrees of integration and more I/O connections. China, Japan, and Taiwan are the possible markets that might have much greater growth rates throughout the projected period as significant manufacturers implement cutting-edge flip-chip technology. In light of all of these investments and developments, it is projected that the Asia Pacific flip-chip technology market would grow rapidly.

Market Key Developments

• In September 2022, The LinuxONE server, a highly scalable Linux and Kubernetes-based platform created to support thousands of workloads inside the footprint of a single machine, has undergone an update from IBM. Features in IBM LinuxONE Emperor 4 may let users conserve energy.
• In November 2021, In Bac Ninh, Vietnam, Amkor Technology Inc. (NASDAQ: AMKR), a top supplier of semiconductor packaging and test services, intended to construct a cutting-edge smart factory.
• In March 2021, to enable the commercial availability of Future Access, the 28GHz 5G mm-Wave module with the highest level of integration in the market, for both the mobile and fixed wireless infrastructure industries, Fujikura, Ltd. has announced a partnership with GlobalFoundries (GF).

 

Segmentation:

• By Technology
• Ball Grid Array
• Chip Scale Package
• By Bumping Technology
• Copper Pillar
• Gold Stud Bumping
• Lead-Free Solder
• Tin-Lead Eutectic Solder
• By Application
• Consumer Electronics
• Automotive
• Aerospace & Defense
• Healthcare
• Others
• By Geography

 

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• UK
• Germany
• France
• Italy
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Taiwan
• Australia
• Others

1.  INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY 

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Force Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

5. FLIP CHIP TECHNOLOGY MARKET ANALYSIS, BY TECHNOLOGY

5.1. Introduction

5.2. Ball Grid Array

5.3. Chip Scale Package

6. FLIP CHIP TECHNOLOGY MARKET ANALYSIS, BY BUMPING TECHNOLOGY

6.1. Introduction

6.2. Copper Pillar

6.3. Gold Stud Bumping

6.4. Lead-Free Solder

6.5. Tin-Lead Eutectic Solder

7. FLIP CHIP TECHNOLOGY MARKET ANALYSIS, BY APPLICATION

7.1. Introduction

7.2. Consumer Electronics

7.3. Automotive

7.4. Aerospace & Defense

7.5. Healthcare

7.6. Others

8. FLIP CHIP TECHNOLOGY MARKET ANALYSIS, BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. USA

8.2.2. Canada

8.2.3. Mexico

8.3. South America

8.3.1. Brazil

8.3.2. Argentina

8.3.3. Others

8.4. Europe

8.4.1. UK

8.4.2. Germany

8.4.3. France

8.4.4. Italy

8.4.5. Spain

8.4.6. Others

8.5. Middle East and Africa

8.5.1. Saudi Arabia

8.5.2. UAE

8.5.3. Others

8.6. Asia Pacific

8.6.1. China

8.6.2. Japan

8.6.3. India

8.6.4. South Korea

8.6.5. Taiwan

8.6.6. Australia

8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Emerging Players and Market Lucrativeness

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

10.1. Amkor Technology Inc

10.2. Chipbond Technology Corporation

10.3. ASE Group

10.4. Powertech Technology Inc

10.5. Texas Instruments

10.6. Intel Corporation

10.7. United Microelectronics Corporation

 

10.8. FlipChip International LLC

Amkor Technology Inc

Chipbond Technology Corporation

ASE Group

Powertech Technology Inc

Texas Instruments

Intel Corporation

United Microelectronics Corporation

FlipChip International LLC