5G Semiconductor Market Size, Share, Opportunities, And Trends By Application (Consumer Electronics (Smartphones (Premium, Basic), Others), Infrastructure, Others), By Component (Baseband Processors, RF, Power Management), By Frequency (Sub-6 GHz, MmWave), And By Geography - Forecasts From 2024 To 2029

The global 5G semiconductor market is expected to grow at a CAGR of 9.78% from US$23.742 billion in 2022 to US$45.625 billion in 2029.

GROWTH DRIVERS

• 5G facilitates development of semiconductor industry

With the rapid growth of 5G and IoT devices in the market, the demand for high-quality semiconductor chips is also on the rise. The demanding requirements of 5G products, such as faster network speed, higher frequency bands, greater connections, lower network latency, and more reliable network performance, require advanced chip design and manufacturing technology. Many innovators long for the huge opportunities provided by 5G, and the semiconductor industry has to boost wafer and chip production to meet the technical requirements in the near future. The semiconductor industry is also showing growth driven by smartphones, promoting the entire industry chain to a higher level of development.

For instance:

• In September 2023, there was a pact signed by Qualcomm Technologies, Inc. and Apple Inc. that would enable Snapdragon® 5G Modem-RF Systems to be used in smartphones manufactured during the years 2024-2026. This association shows Qualcomm's continuous lead in the field of 5G technology and products.
• In July 2023, Intel released information about an important partnership with Ericsson aimed at using Intel’s advanced18A process and manufacturing technology for Ericsson’s next-generation optimized 5G infrastructure coming soon. Together with this association, Intel will deliver custom-designed SoC (system-on-chip) for Ericsson targeting unique offerings that will define future of 5G infrastructure.
• MediaTek launched Dimensity 1050 system-on-chip (SoC), its first foray into mmWave 5G chipsets in May, 2022. The chipset is expected to power the next generation of 5G smartphones that will feature seamless connectivity, high-quality displays as well as gaming capabilities and exceptional power efficiency. By employing dual connectivity via both mmWave and sub-6GHz, Dimensity1050 is expected to enhance smartphone experience by providing speeds and capacity required to sustain other applications even within densely populated areas.

Development in Advanced Chip and Packaging Technology.

• In order to satisfy the need for semiconductors, advanced packaging takes center stage in emerging technology applications which are quickly going mainstream — including 5G, autonomous vehicles, IoT technologies, and virtual/augmented reality. The new technology calls for more robust chips that are also highly efficient due to the high data transfer speeds plus minimal latency. This innovation has driven the development of chips like 5G modems and RFICs alongside mmWave components. With regards to 5G communication (and even beyond), reducing transmission loss poses a major technical challenge; however, engineers address this issue through using advanced packaging technologies that enable placing the antenna close to RF IC chip— thus significantly minimizing transmission loss. Currently, AiP is seen as the most viable solution for 5G mmWave technology.

A partnership named OIP 3DFabric was unveiled by TSMC in October 2022 — intending to be a major player in the semiconductor and system innovation landscape. This is the sixth alliance under TSMC's OIP Alliances which it has introduced earlier, and stands as a landmark initiative in the world of semiconductors. It aims at fostering collaboration with partners on 3D IC ecosystem innovation, along with readiness through a wide array of high-quality solutions and services for semiconductor design, memory modules, substrate technology, testing, manufacturing and packaging.

The expansion of smartphones is driving up the need for semiconductors in these gadgets. Growth in smart technologies among mobile phones is contributing significantly to this demand, as well as rapid deployment of new advanced mobile communication standards like 5G.

RISING ADOPTION OF SMARTPHONES:

The rise of smartphone usage is increasing the need for semiconductors in these devices. The main factors contributing to this high demand are the high adoption of smart technologies in mobile phones and the fast transition to advanced mobile communications standards like 5G. The arrival of 5G technology and recent government approvals will create ample possibilities for smartphone users. The increase in mobile device shipments, with smartphones leading the way, is leading to an expansion of the semiconductor market with the various semiconductor components that are incorporated in smartphones, like application processors, modems, wireless connectivity ICs, audio ICs, and MEMS sensors.

In line with the GSMA Mobile Economy Report 2023, the data based on regional Smartphone adoption in 2022 depicts steady growth across different parts. The most striking surge is seen in North America which topped smartphone adoption rates in 2022 at a remarkable 84% of total mobile connections; closely tailed by Greater China and Europe both standing strong at 81%. CIS and Asia Pacific regions are on the brink of major upsurge as they are expected to hit adoption rates of 80% and 74% correspondingly. This statistics highlights not only the strong global drift towards smartphone usage but also paints emerging markets in bold colors— showing sizable strokes of potentiality for further growth.

GEOGRAPHICAL PRESENCE

• In August 2022, Micron Technology, Inc. revealed its intentions to invest $40 billion over the next decade. They plan to establish state-of-the-art memory manufacturing facilities in the United States, to be completed in several stages. Micron's advanced manufacturing in the U.S. is vital for national security and ensuring a robust supply chain. This investment is driven by the rising need for memory in essential markets, including automotive and data centers, due to the increasing use of artificial intelligence and 5G technology.
• In March 2023, Polymatech Electronics, India's exclusive semiconductor chip producer, is preparing to begin large-scale production of state-of-the-art semiconductor parts in India, focusing on 5G and 6G applications. After undergoing testing, Polymatech will commence chip manufacturing at its primary production facility in Kancheepuram, Tamil Nadu. Polymatech's semiconductors will not only cut down on the expenses of obtaining components for telecommunications businesses but also lead to decreased power loss and greater efficiency.
• In August 2022, GlobalFoundries and Qualcomm unveiled their intention to significantly expand their ongoing, long-term semiconductor manufacturing partnership. This expansion secures a steady supply of wafers and reinforces the commitment to support semiconductor manufacturing in the United States, with an emphasis on enhancing capacity at GlobalFoundries' cutting-edge semiconductor production facility in Malta, New York. This announcement extends Qualcomm Technologies and GlobalFoundries' collaboration in the United States, particularly in the areas of FinFET technology for 5G transceivers, Wi-Fi, automotive, and IoT connectivity.

MAJOR PLAYERS IN THE MARKET

Several key players in the market, including Arctic Semiconductor, Qualcomm, Samsung Huawei and others, offer a wide range of product offerings, which encompass:

 

COMPANY NAME	PRODUCT NAME	DESCRIPTION
Arctic Semiconductor	IceWings	Arctic Semiconductor has introduced a unique range of RF transceivers called IceWings. These transceivers support all 5G/4G bands from 600MHz to 7.2GHz, in addition to WiFi 6/6e/7 bands. IceWings is an advanced RF transceiver equipped with four built-in transmitters and receivers.
Qualcomm	Snapdragon® 865	The Snapdragon 865 is created to work alongside Qualcomm's 2nd generation 5G modem, the Snapdragon X55 5G modem (an external 7nm baseband chip crafted by TSMC), and an RF front-end interface chip (RFFE). This combination enables 5G NR, sub-6 GHz, and mmWave support.
Samsung	Exynos 990	The Exynos 990 processor, when used with the next-generation 5G technology, the Exynos Modem 5123, offers extremely high-speed mobile broadband right at your fingertips. This modem allows for lightning-fast download speeds of up to 7.35Gbps in mmWave and 5.1Gbps in the sub-6GHz setting, with support for up to 8x carrier aggregation.
Huawei Technologies Co., Ltd.	Kirin 990 5G	The Kirin 990 5G is Huawei's inaugural flagship 5G System on a Chip (SoC). It employs the advanced 7nm+ EUV process, integrating the 5G modem directly into the SoC chip. This SoC also features the HUAWEI Da Vinci Architecture, which includes a dual-core NPU alongside a tiny-core NPU.

5G Semiconductor Market Scope:

 

 

Report Metric	Details
Market Size Value in 2022	US$23.742 billion
Market Size Value in 2029	US$45.625 billion
Growth Rate	CAGR of 9.78% from 2022 to 2029
Study Period	2019 to 2029
Historical Data	2019 to 2022
Base Year	2023
Forecast Period	2024 – 2029
Forecast Unit (Value)	USD Billion
Segments Covered	Application Component Frequency Geography
Companies Covered	Arctic Semiconductor Polymatech Qualcomm Advanced Micro Devices, Inc. Samsung
Regions Covered	North America, South America, Europe, Middle East and Africa, Asia Pacific
Customization Scope	Free report customization with purchase

 

SEGMENTATION

The global 5G semiconductor market has been analyzed through the following segments:

• By Application
  • Consumer Electronics
    • Smartphones
      • Premium
      • Basic
    • Others
  • Infrastructure
  • Others
• By Component
  • Baseband Processors
  • RF
  • Power Management
• By Frequency
  • Sub-6 GHz
  • mmWave
• By Geography
  • Americas
    • United States
    • Others
  • EMEA
    • Germany
    • UK
    • Others
  • APAC
    • China
    • Japan
    • South Korea
    • Others

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1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Market Segmentation

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Bandwidth Availability

4.4. Number of Users

5. GOVERNMENT REGULATIONS/POLICIES

6. 5G SEMICONDUCTOR MARKET, BY APPLICATION 

6.1. Introduction

6.2. Consumer Electronics

6.2.1. Smartphones

6.2.1.1. Premium

6.2.1.2. Basic

6.2.2. Others

6.3. Infrastructure

6.4. Others

7. 5G SEMICONDUCTOR MARKET, BY COMPONENT

7.1. Introduction

7.2. Baseband Processors

7.3. RF

7.4. Power Management

8. 5G SEMICONDUCTOR MARKET, BY FREQUENCY

8.1. Introduction

8.2. Sub-6 GHz

8.3. mmWave

9. 5G SEMICONDUCTOR MARKET, BY GEOGRAPHY

9.1. Introduction

9.2. Americas

9.2.1. United States

9.2.2. Others

9.3. Europe, Middle East and Africa

9.3.1. Germany

9.3.2. UK

9.3.3. Others

9.4. Asia Pacific

9.4.1. China

9.4.2. Japan

9.4.3. South Korea

9.4.4. Others

10. RECENT DEVELOPMENT AND INVESTMENTS

11. COMPETITIVE ENVIRONMENT AND ANALYSIS

11.1. Major Players and Strategy Analysis

11.2. Vendor Competitiveness Matrix

12. COMPANY PROFILES

12.1. Arctic Semiconductor

12.2. Polymatech

12.3. Qualcomm

12.4. Advanced Micro Devices, Inc.

12.5. Samsung

12.6. Huawei Technologies Co., Ltd.

12.7. MediaTek Inc.

12.8. Intel Corporation

Arctic Semiconductor

Polymatech

Qualcomm

Advanced Micro Devices, Inc.

Samsung

Huawei Technologies Co., Ltd.

MediaTek Inc.

Intel Corporation