5G PCB Market Size, Share, Opportunities, And Trends By Type (Single-sided, Double-sided, Multi-layered, High-density Interconnect (HDI), Others), By Substrate (Rigid, Flexible, Rigid-Flexible), By End Use Industry (Automotive, Telecommunication, Consumer Electronics, Industrial, Others), And By Geography - Forecasts From 2024 To 2029

The 5G PCB market was valued at US$27.189 billion in 2022 and poised to grow to US$47.569 billion in 2029 at a CAGR of 8.32%.

GROWTH DRIVERS

• Growing applicability in consumer and industrial electronics is expected to drive the market demand for 5G PCBs.

Printed circuit boards (PCBs) through conductive pathways provide mechanical support to electronics equipment owing to which they form an integral part of the equipment. The growing transition from 4G to 5G has established a new framework associated with the designing and material usage in PCBs to improve overall performance. In comparison to its predecessor, the 5G network features a quick response rate and wider network coverage which is driving its applicability in major sectors such as telecommunication, consumer electronics, automotive, and industrial among others.

Major economies namely China, the United States, and Japan are experiencing a significant boom in consumer electronics demand and consumption which has bolstered the overall manufacturing output of the nations. For instance,  according to the National Bureau of Statistics, in November 2023, the production output of China’s communication equipment, computers, and other electronics experienced a 10.6% growth over the previous year.

• Favorable investment in smart factories has propelled market growth.

Technological advancement has paved the way to solve industrial complexities and with the constant boom in 5G product demand investments are being made in smart manufacturing. Hence, governments as well as various private companies are initiating strategies to bolster industrial automation which has propelled the scope of 5G smart factories in major economies.

For instance, in May 2024, Ericsson announced additional funding of US$50 that would be used in the expansion of its 5G smart factory situated in Texas. The expansion would enable the company to address the growing demand for 5G infrastructure in the USA.

Likewise, in October 2023, VVDN Technologies in collaboration with Telit Cinterion and the Union Minister of Railways, Communication, Electronics, Information & Technology established a dedicated SMT line for manufacturing 5G connectivity modules. The new establishment will cater to the growing 5G demand for Hi-tech products. 

EMERGING OPPORTUNITIES IN THE GLOBAL 5G PCB MARKET

• TELECOMMUNICATION AND CONSUMER ELECTRONICS

Based on end-users, the 5G PCBs market is divided into automotive, telecommunication, consumer electronics, industrial, and others. Telecommunication and consumer electronics are anticipated to hold a significant market share furled by the favorable investment in the commercialization of private 5Gs. Moreover, the boom in modern technological options usage is further driving the demand for wireless communication networks thereby positively impacting the PCB's demand for 5G applications in such sectors.

Hence, companies are investing in new facility establishments, MOUs, strategic partnerships, and mergers to improve their product offerings, which is acting as an additional driving factor. For instance,

• In February 2023, TTM Technologies Inc. introduced 0603 narrow and broadband balun transformers and couplers which has expanded the company’s “RF&S” (Radio Frequency Specialty Components) business. The extensive portfolio would enable the company to meet the demand for hybrid couplers and balun transformers for 5G transceivers.
• In May 2022, Qualcomm Technologies Inc. formed a collaboration with Viettel Group for the development of next-generation 5G DUs (Distributed Units) and RUs (Radio Units) having massive MIMO capabilities. The collaboration would involve integrating Qualcomm’s “X100 5G RAN Accelerator Card” and “MIMO Qualcomm® QRU100” 5G RAN with Viettel’s advanced software & hardware systems and would roll out a 5G network in Vietnam.  

GEOGRAPHICAL PRESENCE

5G PCB market, based on geography consists of major countries namely the United States, China, Japan, South, and Germany among others. The mentioned countries are experiencing significant growth in their 5G transition backed by favorable government investments, and policies. Moreover, product launches and the ongoing “Industry 4.0” which aimed to bolster industrial automation are acting as additional factors for regional market growth.

• In April 2022, KLA Corporation launched “Frontline Cloud Services” that would enhance time-to-market (TTM) and DFM (Design-For Manufacturing) analysis for printed circuit boards which would be used in 5G and mini LED applications. The software solution would remove the complexity in the designing process and any other bottlenecks that would increase the overall analysis timings.

MAJOR PLAYERS IN THE MARKET

Some of the leading players in the market include PCBMay, Epec, and Jagrat RF Solutions, among others. The product offerings of the major corporation include the following:

Segmentation:

• By Type
  • Single-Sided
  • Double-Sided
  • Multi-Layered
  • High-Density Interconnect (HDI)
  • Others
• By Substrate
  • Rigid
  • Flexible
  • Rigid-Flexible
• By End-User Industry
  • Automotive
  • Telecommunication
  • Consumer Electronics
  • Industrial
  • Others
• By Geography
  • Americas
    • United States
    • Others
  • Europe, Middle East, and Africa
    • Germany
    • UK
    • Others
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Market Segmentation

2. RESEARCH METHODOLOGY  

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Bandwidth Availability

4.4. Number of Users

5. GOVERNMENT REGULATIONS/POLICIES

6. 5G PCB MARKET, BY TYPE

6.1. Introduction

6.2. Single-sided

6.3. Double-sided

6.4. Multi-layered

6.5. High-density Interconnect (HDI)

6.6. Others

7. 5G PCB MARKET, BY SUBSTRATE

7.1. Introduction

7.2. Rigid

7.3. Flexible

7.4. Rigid-Flexible

8. 5G PCB MARKET, BY END-USE INDUSTRY

8.1. Introduction

8.2. Automotive

8.3. Telecommunication

8.4. Consumer Electronics

8.5. Industrial

8.6. Others

9. 5G PCB MARKET BY GEOGRAPHY

9.1. Introduction

9.2. Americas

9.2.1. United States

9.2.2. Others

9.3. Europe, Middle East and Africa

9.3.1. Germany

9.3.2. UK

9.3.3. Others

9.4. Asia Pacific

9.4.1. China

9.4.2. Japan

9.4.3. South Korea

9.4.4. Others

10. RECENT DEVELOPMENT AND INVESTMENTS

11. COMPETITIVE ENVIRONMENT AND ANALYSIS

11.1. Major Players and Strategy Analysis

11.2. Vendor Competitiveness Matrix

12. COMPANY PROFILES

12.1. Millennium Circuits Limited

12.2. Rayming Technology

12.3. Jagat RF Solutions (India) Pvt. Ltd.

12.4. PCBMay

12.5. VSE

12.6. Epec, LLC

12.7. PCB Trace Technologies Inc

12.8. ABL Circuits

Millennium Circuits Limited

Rayming Technology

Jagat RF Solutions (India) Pvt. Ltd.

PCBMay

VSE

Epec, LLC

PCB Trace Technologies Inc

ABL Circuits