3D Semiconductor Packaging Market Size, Share, Opportunities, And Trends By Technology (Through Silicon Vias, Fan Out Wafer Level Packaging, Wire Bonding, Others), By Industry Vertical (Electronics, Communication and Technology, Manufacturing, Automotive, Defense and Aerospace, Healthcare, Others), By Material (Bonding Wire, Lead frame, Organic Substrate, Encapsulation Resin, Ceramic Package, Die Attach Material, Others), And By Geography - Forecasts From 2025 To 2030

The 3D semiconductor packaging market is projected to grow at a CAGR of 12.68% between 2025 to 2030.

The three-dimensional integrated circuits (ICs) are integrated circuits manufactured using a new packaging technology of stacking silicon wafers and interconnecting them vertically using Through Silicon Vias (TSVs) or Cu-Cu connections, so that they behave as a single device, achieving improved performance at reduced power and smaller footprint than two-dimensional processes. The 3D semiconductor packaging market is expected to grow at a significant CAGR of 14.46% to reach a market size of US$6.044 billion in 2024 from US$2.688 billion in 2018. As the demand for higher capacity electronic devices with more efficient power consumption increases, it drives the need to implement 3D ICs in various such devices.

DRIVERS

Increasing global demand for high-end electronic devices using miniaturized circuits with low power consumption and reduced size.
Heavy investments on the R&D by many key industry players.

RESTRAINTS

Competition from already established tech giants who are heavily investing in this area.
Lack of clarity regarding standardization and ownership concerns

RECENT DEVELOPMENTS

In 2015, Jiangsu Chanjiang Electronics Technology Co. Ltd acquired Statschippac to augment its R&D capabilities.
ASE Group is considering a merger with SPIL.

Segmentation

The 3D Semiconductor packaging market has been analyzed through the following segments:

• By Technology
  • Through Silicon Vias (TSV)
    Fan Out Wafer Level Packaging
    Wire Bonding
    Others
• By Industry Vertical
  • Electronics
    Communication and Technology
    Manufacturing
    Automotive
    Defense and Aerospace
    Healthcare
    Others
• By Material
  • Bonding Wire
    Lead frame
    Organic Substrate
    Encapsulation Resin
    Ceramic Package
    Die Attach Material
    Others
• By Geography
  • Americas
    • US
  • Europe Middle East and Africa
    • Germany
    • Netherlands
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Currency

1.5. Assumptions

1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Secondary Sources

3. KEY FINDINGS

4. MARKET DYNAMICS

4.1. Market Segmentation

4.2. Market Drivers

4.3. Market Restraints

4.4. Market Opportunities

4.5. Porter’s Five Forces Analysis

4.5.1. Bargaining Power of Suppliers

4.5.2. Bargaining Power of Buyers

4.5.3. Threat of New Entrants

4.5.4. Threat of Substitutes

4.5.5. Competitive Rivalry in the Industry

4.6. Life Cycle Analysis - Regional Snapshot

4.7. Market Attractiveness

5. 3D SEMICONDUCTOR PACKAGING MARKET BY TECHNOLOGY

5.1. Through Silicon Vias (TSV)

5.2. Fan Out Wafer Level Packaging

5.3. Wire Bonding

5.4. Others

6. 3D SEMICONDUCTOR PACKAGING MARKET BY INDUSTRY VERTICAL

6.1. Electronics

6.2. Communication and Technology

6.3. Manufacturing

6.4. Automotive

6.5. Defense and Aerospace

6.6. Healthcare

6.7. Others

7. 3D SEMICONDUCTOR PACKAGING MARKET BY MATERIAL

7.1. Bonding Wire

7.2. Lead frame

7.3. Organic Substrate

7.4. Encapsulation Resin

7.5. Organic Substrate

7.6. Ceramic Package

7.7. Die Attach Material

7.8. Others

8. 3D SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

8.1. Americas

8.1.1. US

8.2. Europe Middle East and Africa

8.2.1. Germany

8.2.2. Netherlands

8.2.3. Others

8.3. Asia-Pacific

8.3.1. China

8.3.2. Japan

8.3.3. South Korea

8.3.4. Taiwan

8.3.5. Others

9. COMPETITIVE INTELLIGENCE

9.1. Competitive Benchmarking and Analysis

9.2. Recent Investments and Deals

9.3. Strategies of Key Players

10. COMPANY PROFILES

10.1. Samsung Electronics

10.2. Intel Corporation

10.3. Xilinx

10.4. Sony

10.5. Taiwan Semiconductor Manufacturing Company

10.6. Amkor Technology Inc

10.7. ASE Group

10.8. Microchip

10.9. Siliconware PrecisionIndustries Co.

10.10. GlobalFOundries Inc

10.11. Applied Materials

10.12. International Busines Machines Corp.

10.13. Tezzaron Semiconductors

10.14. STATS ChipPac Ltd

10.15. Micralyne, Inc

10.16. Toshiba

10.17. SK Hynix

LIST OF FIGURES

LIST OF TABLES

Samsung Electronics
Intel Corporation
Xilinx
Sony
Taiwan Semiconductor Manufacturing Company Ltd
Amkor Technology Inc
ASE Group
Microchip
Siliconware Precision Industries Co
GlobalFoundries Inc.
Applied Materials
International Business Machines Corp.
Tezzaron Semiconductors
STATS ChipPAC Ltd
Micralyne, Inc
Toshiba Corp.
SK Hynix