Semiconductor Bonding Equipment Market Size, Share, Opportunities, And Trends By Equipment Type (Permanent Bonding Equipment, Temporary Bonding Equipment, Hybrid Bonding Equipment), By Bonding Type (Wire Bonding, Wafer Bonding, Die Bonding), By Application (3D IC, MEMS, CMOS, Advanced Packaging, Photonic Devices, Others), And By Geography - Forecasts From 2023 To 2028

Semiconductor bonding equipment is the set of tools and technology used to connect semiconductors and other integrated circuit chips with silicon chips and substrates using wires, wafers, and die-bonding solutions. The connection thus created could be permanent, temporary, or hybrid. The extensive use of semiconductors across different industries such as consumer electronics and 3D devices is resulting in the increasing adoption of semiconductor bonding equipment in 3D integrated chips, advanced packaging solutions, and CMOS systems. Therefore, considering the growing production of devices using semiconductor bonding, it can be anticipated that the semiconductor bonding equipment will steadily grow over the forecast period.

Market Drivers

• Rise in the demand for microelectromechanical devices (MEMS)

The developments in the nanotechnological field of portable electronics are creating a high demand for this wafer and stack die technology across the consumer electronic sector. Gyroscopes, microphones, light sensors, and accelerometers are some of the most dominantly used micro-electromechanical sensors used in smartphones. In addition, leading technological devices are adopting die stack technology to enhance the connectivity between circuits and improve the performance of electronics.  Therefore, this generates a high demand for wafer bonding and die bonding equipment for semiconductors used in consumer electronic goods. In addition, the extensive adoption of MEM devices in telecommunications, micropositioners, and displays used for projection is also promoting the use of semiconductor bonding equipment. Therefore, the rising international demand for portable and other electronics is anticipated to promote the consumption of semiconductor bonding equipment over the forecast period.

• Enlargement of electric vehicle manufacturing activities

The increasing demand and investment in the use of sustainable energy sources are resulting in the rise in the consumption of electric vehicles across the world. For instance, the International Energy Agency estimated that the total number of electric vehicles sold across the world in 2022 increased two times from the total number of electric vehicles sold in 2021 to reach 6.6 million. In addition, leading companies like Tesla and Ford are developing new technologies to enhance their electric vehicles. The batteries produced for electric vehicles employ wire-bonding equipment to make connections between different cells. Since each battery requires several interconnections, an enormous amount of wire-bonding equipment is employed to meet the production pace of manufacturing companies. Therefore, the increasing demand for electric vehicles is resulting in the increase of electric vehicle production across the world which is anticipated to stimulate the demand for semiconductor bonding equipment.

The prevalence of wire bond failure is restraining the growth of the semiconductor bonding equipment market.

The wires used in wire bonding equipment are prone to corrosion which could lead to inefficiencies in the working of semiconductors or lead to breakage in the connection of semiconductor components. The contamination of silicone and halogen used in wires could lower the adhesive power of wires. Therefore, the metal platforms used as part of the semiconductor assembly processes should be free from contamination as the presence of pollutants, dust, and grease could create unstable bonding. Plasma treatments and laser cleaning methods are usually adopted to prevent such failures. However, such treatments can only lower the occurrence of such wire bond failures and cannot completely eliminate them. Therefore, this could slow down the growth of the semiconductor bonding equipment in the wire bonding sector.

Key Developments

• In September 2022, Henniker Plasma, a company producing plasma-based technology and solutions announced its new plasma cleaning treatment solution for reducing corrosion of components linked using wire bonding equipment.
• In December 2020, EV Group, a company specializing in producing semiconductor wafer bonding tools and other equipment, announced the launch of EVG®320, a hybrid bonding equipment based on die-to-wafer-bonding technology with the ability to integrate with diverse technological applications.
• In October 2020, BE Semiconductor Industries N.V., a company specializing in the production of equipment used to assemble semiconductors announced its collaboration with Applied Materials, Inc. to innovate a new die-based hybrid bonding technique with the ability to incorporate computer technology such as AI.

Asia Pacific holds a prominent share of the semiconductor boding equipment market and is expected to grow in the forecast period.

The semiconductor boding equipment market in the Asia Pacific region is experiencing significant growth due to the escalating demand for semiconductors across major Asian economies such as China and South Korea. The rise in the demand for semiconductor bonding equipment across the region can be associated with the increased consumption of photonic equipment and 3D-integrated chips. The developments in photonic technology are expanding the application scope of photonic devices across the energy, entertainment, telecommunication, and transportation sector as lasers, optical fibers, and other lighting solutions. In addition, the developments in wafer technology across major Asian economies like China, Taiwan, Japan, and South Korea are increasing the demand for thin wafers in display driver ICs and other integrated chips. This is generating a high demand for hybrid bonding equipment such as die-to-wafer and wafer-to-wafer bonding equipment. Therefore, the expansion of the semiconductor industry can be anticipated to proportionately expand the semiconductor equipment market in the Asia Pacific region over the forecast period.

Key Market Segments:

• By Equipment Type

• Permanent Bonding Equipment
• Temporary Bonding Equipment
• Hybrid Bonding Equipment

• By Bonding Type

• Wire Bonding
• Wafer Bonding
• Die Bonding

• By Application

• 3D IC
• MEMS
• CMOS
• Advanced Packaging
• Photonic Devices
• Others

• By Geography

• North America

• USA
• Canada
• Mexico

• South America

• Brazil
• Argentina
• Others

• Europe

• United Kingdom
• Germany
• France
• Italy
• Spain
• Others

• Middle East and Africa

• Saudi Arabia
• UAE
• Others

• Asia Pacific

 

• China
• Japan
• India
• South Korea
• Taiwan
• Others

1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY 

2.1. Research Data

2.2. Assumptions

3. EXECUTIVE SUMMARY

3.1. Research Highlights

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Market Opportunities

4.4. Porter’s Five Force Analysis

4.4.1. Bargaining Power of Suppliers

4.4.2. Bargaining Power of Buyers

4.4.3. Threat of New Entrants

4.4.4. Threat of Substitutes

4.4.5. Competitive Rivalry in the Industry

4.5. Industry Value Chain Analysis

5. SEMICONDUCTOR BONDING EQUIPMENT MARKET ANALYSIS, BY EQUIPMENT TYPE

5.1. Introduction

5.2. Permanent Bonding Equipment

5.3. Temporary Bonding Equipment

5.4. Hybrid Bonding Equipment

6. SEMICONDUCTOR BONDING EQUIPMENT MARKET ANALYSIS, BY BONDING TYPE

6.1. Introduction

6.2. Wire Bonding

6.3. Wafer Bonding

6.4. Die Bonding

7. SEMICONDUCTOR BONDING EQUIPMENT MARKET ANALYSIS, BY APPLICATION

7.1. Introduction

7.2. 3D IC

7.3. MEMS

7.4. CMOS

7.5. Advanced Packaging

7.6. Photonic Devices

7.7. Others

8. SEMICONDUCTOR BONDING EQUIPMENT MARKET ANALYSIS, BY GEOGRAPHY

8.1. Introduction

8.2. North America

8.2.1. USA

8.2.2. Canada

8.2.3. Mexico

8.3. South America

8.3.1. Brazil

8.3.2. Argentina

8.3.3. Others

8.4. Europe

8.4.1. UK

8.4.2. Germany

8.4.3. France

8.4.4. Italy

8.4.5. Spain

8.4.6. Others

8.5. Middle East and Africa

8.5.1. Saudi Arabia

8.5.2. UAE

8.5.3. Others

8.6. Asia Pacific

8.6.1. China

8.6.2. Japan

8.6.3. India

8.6.4. South Korea

8.6.5. Taiwan

8.6.6. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

9.1. Major Players and Strategy Analysis

9.2. Emerging Players and Market Lucrativeness

9.3. Mergers, Acquisitions, Agreements, and Collaborations

9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

10.1. EV Group

10.2. ASMPT Semiconductor Solutions

10.3. MRSI Systems

10.4. WestBond Inc

10.5. Panasonic Industry Co Ltd

10.6. Palomar Technologies

10.7. Tresky AG

10.8. BE Semiconductor Industries NV

10.9. Fasford Technology (Fuji Group)

 

10.10. Kulicke and Soffa Industries Inc

EV Group

ASMPT Semiconductor Solutions

MRSI Systems

WestBond Inc

Panasonic Industry Co Ltd

Palomar Technologies

Tresky AG

BE Semiconductor Industries NV

Fasford Technology (Fuji Group)

 

Kulicke and Soffa Industries Inc