Semiconductor Back-End Equipment Market Size, Share, Opportunities, And Trends By Procedure (Wafer Testing, Bonding, Dicing, Metrology, Assembly Packaging), And By Geography - Forecasts From 2024 To 2029

Semiconductor Back-End Equipment Market Size:

The semiconductor back-end equipment market is expected to grow at a CAGR of 6.89%, reaching a market size of US$157.693 billion in 2030 from US$113.006 billion in 2025.

The market is expected to grow due to the increasing demand for small devices and functional advancements in electronic goods like laptops, digital cameras, smartphones, and others. Since integrated circuit (IC) designs are becoming highly complex and more semiconductor products must be introduced to manufacture ICs, the demand for semiconductor back-end equipment is increasing steadily. Semiconductors are used in IC development because they lower costs, speed up mass production, and increase the operational value of the finished product.

Two processes are involved in producing semiconductors: the front-end and the back-end. Back-end processing is the step-in semiconductor production that comes after the circuit definition on the wafer. Several stages are included in the processes to guarantee the functionality, dependability, performance, and durability of the semiconductor chips. Each process needs a particular set of tools to analyze and function at incredibly minute levels. Therefore, businesses provide the goods and services that semiconductor foundries and manufacturing facilities need to meet the demand for such equipment. The rising worldwide demand for semiconductors across the industrial sector has boosted their production scale, driving the semiconductor back-end equipment market. 

Semiconductor Back-end Equipment Market Drivers:

• High demand for semiconductors

The global demand for semiconductors is increasing owing to growing end-user applications. Younger, emerging companies rely on Original Design Manufacturers (ODMs) and Outsourced Semiconductor Assembly and Test (OSAT) service providers to satisfy the demands for product development and manufacturing. Governments worldwide are focusing on domestic semiconductor production to reduce their reliance on foreign vendors. They welcome direct investment programs from well-known manufacturers and provide favorable regulations.

For instance, the Semiconductor Industry Association (SIA) announced that global semiconductor sales reached US$627.6 billion in 2024, an increase of 19.1% compared to the 2023 total of US$526.8 billion. 

• Rising need in the manufacturing industry

Semiconductor wafers, IC chips, memory chips, circuits, and other components are made with semiconductor manufacturing equipment. Silicon wafer manufacturing equipment is used early in the manufacturing process. Photolithography tools, etching machines, chemical vapor deposition machines, measurement machines, and process/quality control apparatus are examples of wafer processing equipment. The semiconductor back-end equipment market is anticipated to be driven by the growing need for discrete devices, power semiconductors, and high-power modules for diverse end users. Moreover, the trend of combining semiconductors onto a single chip is growing as customers' preferences for small-sized products grow. In this case, the main application of this equipment is the assembly of semiconductor parts into a single chip.

• Increasing demand for bonding equipment

The growing need for semiconductor chips with greater efficiency, processing power, and smaller footprints is driving demand for semiconductor bonding equipment, propelling the market expansion during the forecast period. The substantial advancements in front-end processes have also increased the need for semiconductor bonding equipment. Investments in other applications and state-of-the-art packaging technologies also fuel the need for bonding equipment solutions. In addition, producers are focusing on enhancing the semiconductors required to produce back-end machinery and semiconductor manufacturing equipment (SME).

Semiconductor Back-end Equipment Market – Geographical Outlook

• Asia Pacific is witnessing exponential growth during the forecast period.

During the forecast period, the Asia-Pacific semiconductor back-end equipment market is anticipated to grow rapidly. Strategic investments from major domestic suppliers and the growth of the established semiconductor industry are expected to propel the market. As chip consumption rises, the Asia-Pacific semiconductor market is anticipated to more than triple in size from that of the Americas over the next four years.

Additionally, introducing 5G technology has increased demand for semiconductor chips in the region by boosting the market for equipment used in semiconductor manufacturing. It is predicted that 5G technology will significantly improve the digital infrastructure globally.

Semiconductor Back-end Equipment Market Key Launches:

• In October 2024, Rapidus Corporation, which is engaged in the research, development, design, production, and sales of next-generation logic semiconductors, announced that it would establish a clean room in Seiko Epson Corporation's Chitose, Hokkaido facility and open a semiconductor post-processing research-and-development (R&D) center named Rapidus Chiplet Solutions (RCS).

Semiconductor Back-End Equipment Market Scope:

Report Metric	Details
Semiconductor Back-End Equipment Market Size in 2025	US$113.006 billion
Semiconductor Back-End Equipment Market Size in 2030	US$157.693 billion
Growth Rate	CAGR of 6.89%
Study Period	2020 to 2030
Historical Data	2020 to 2023
Base Year	2024
Forecast Period	2025 – 2030
Forecast Unit (Value)	USD Billion
Segmentation	Procedure Geography
Geographical Segmentation	Americas, Europe, Middle East, and Africa, Asia Pacific
List of Major Companies in the Semiconductor Back-End Equipment Market	ASML Holding N.V. Applied Materials Lam Research Tokyo Electron Limited Rapidus Corporation
Customization Scope	Free report customization with purchase

 

Semiconductor Back-End Equipment Market Segmentation: 

• By Procedure
  • Wafer Testing
  • Bonding
  • Dicing
  • Metrology
  • Assembly Packaging
• By Geography
  • Americas
    • US
  • Europe, the Middle East, and Africa
    • Germany
    • Netherland
    • Others
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Others

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1. EXECUTIVE SUMMARY 

2. MARKET SNAPSHOT

2.1. Market Overview

2.2. Market Definition

2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE 

3.1. Market Drivers

3.2. Market Restraints

3.3. Market Opportunities 

3.4. Porter’s Five Forces Analysis

3.5. Industry Value Chain Analysis

3.6. Policies and Regulations 

3.7. Strategic Recommendations 

4. TECHNOLOGICAL OUTLOOK 

5. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY PROCEDURE

5.1. Introduction

5.2. Wafer Testing

5.3. Bonding

5.4. Dicing

5.5. Metrology

5.6. Assembly Packaging

6. SEMICONDUCTOR BACK-END EQUIPMENT MARKET BY GEOGRAPHY

6.1. Introduction

6.2. Americas

6.2.1. USA

6.3. Europe, Middle East, and Africa

6.3.1. Germany

6.3.2. Netherlands

6.3.3. Others

6.4. Asia Pacific

6.4.1. China

6.4.2. Japan

6.4.3. Taiwan

6.4.4. South Korea

6.4.5. Others

7. COMPETITIVE ENVIRONMENT AND ANALYSIS

7.1. Major Players and Strategy Analysis

7.2. Market Share Analysis

7.3. Mergers, Acquisitions, Agreements, and Collaborations

7.4. Competitive Dashboard

8. COMPANY PROFILES

8.1. ASML Holding N.V.

8.2. Applied Materials

8.3. Lam Research

8.4. Tokyo Electron Limited

8.5. Rapidus Corporation

8.6. KLA Corporation

8.7. Onto Innovation Inc.

8.8. SCREEN Holdings Co., Ltd.

8.9. Toshiba Corporation

9. APPENDIX

9.1. Currency 

9.2. Assumptions

9.3. Base and Forecast Years Timeline

9.4. Key benefits for the stakeholders

9.5. Research Methodology 

9.6. Abbreviations 

LIST OF FIGURES

LIST OF TABLES

ASML Holding N.V.

Applied Materials

Lam Research

Tokyo Electron Limited

Rapidus Corporation

KLA Corporation

Onto Innovation Inc.

SCREEN Holdings Co., Ltd.

Toshiba Corporation