Global Low Temperature Co Fired Ceramic Substrate Market Size, Share, Opportunities, And Trends By Type (RF System Level Package, Optoelectronic Package, Array Package, Others), By End-User Industry (Consumer Electronics, Automotive, Aerospace and Military, Telecommunication, Others), And By Geography - Forecasts From 2024 To 2029

The global low temperature co-fired ceramic substrate market is expected to grow at a CAGR of 7.56%, reaching a market size of US$14.756 billion in 2029 from US$8.860 billion in 2022.

The global low temperature co fired ceramic (LTCC) substrate market is driven by various key factors. LTCC substrates are utilized across a broad spectrum of industries, including telecommunications, medical, automotive, industrial, defense, and aerospace. Their ability to integrate passive components and deliver high-frequency performance makes them particularly suitable for smartphones, tablets, and other compact electronic devices.

The market is further fueled by the economic expansion of regions like Asia and Africa and by developments such as Polymatech's launch of advanced semiconductor components for 5G and 6G applications in India. Leveraging Polymatech's technology and expertise in LTCC and HTCC packaging enables the creation of miniaturized communication and sensor modules operating at very high frequencies and with other features.

Moreover, the increasing demand for smartphones, as evidenced by the rise in U.S. imports of cellular phones from China and Vietnam between 2019 and 2022, is further propelling the market. In 2022, the U.S. imported $50 billion worth of cellular phones from China and $11 billion from Vietnam.  Additionally, the surging popularity of Augmented Reality (AR), Virtual Reality (VR), and 5G technologies contributes to market growth.

Growing demand for electronics devices is anticipated to propel market growth.

The growing demand for electronic goods has led to an increased need for Low-Temperature Co-Fired Ceramic (LTCC), which serves as a multilayer glass-ceramic substrate and serves as an alternative to PCB (Printed Circuit Board) for packaging electronic circuits. The rising demand for smaller, high-performance electronic devices is a key driver of the LTCC substrate market.

Further, LTCC can integrate passive components and offer high-frequency performance making them well-suited for smartphones, tablets, and other compact electronic devices.

U.S. imports of Electronic Products have shown growth in recent years, increasing from $5,71,453 million in 2021 to USD 6,29,871 million in 2022.  Similarly, imports have also risen from $1,83,085 million in 2021 to $1,82,935 million in 2022 from China, accounting for 29% of total imports of these goods in 2022.

The market is projected to grow in the North American region.

In the USA, the demand for substrates made out of low-temperature co-fired ceramic material (LTCC) is exceeding because of the rapid increase and progress of electronic devices all over industries.  Besides that, a substantial proportion of the demand for LTCC substrates is from the automotive industry, powering the trend towards ADAS and advanced in-car electronics, due to their high reliability and thermal stability.

For instance, the reports from the Bureau of Transportation Statistics show that motor vehicle production went up from 8,818 thousand in 2020 to 9,157 thousand by the end of the year 2021. Moreover, the domestic sales were reported to be 11,571 thousand and 11,831 thousand respectively in 2020 and 2021. This growth significantly impacts the overall market expansion.

Furthermore, the thriving healthcare industry in the United States also provides potential for LTCC substrates, notably in medical equipment that needs accuracy and biocompatibility. The National Institutes of Health (NIH), a subsidiary of the Department of Health and Human Services (HHS), which is the largest public sponsor in the field of scientific studies, is in control of the rise of new technologies. While $97 billion, $28 billion as well as $9 billion were provided for basic research, clinical trials with their related activities, and biomedical training of the workforce respectively from 2017 to 2021 by the NIH. Given these mounting investments in research in the country, the market is anticipated to experience substantial growth.

Moreover, ongoing research and development activities aimed at improving LTCC performance and manufacturing methods add to market expansion.

Product innovation and launches have a significant influence on the US low-temperature co-fired ceramic (LTCC) substrate market, impacting competition, growth, and technical development. Innovative LTCC substrate products distinguish businesses, giving them a competitive advantage and driving market growth by meeting rising demands and tapping into new applications.

TTM Technologies manufactures low-temperature cofired ceramics ("LTCC"), thick-film, and typical resistive ceramic components for a variety of applications. The business specializes in the manufacturing of highly tight-tolerance and high-reliability circuits, bringing deep engineering experience and world-class infrastructure to various projects.

Additionally, IKTS offers low-temperature co-fired ceramic tapes (Heratape®CT 700 and Heratape®CT 800 series from Heraeus Deutschland GmbH & Co. KG) for client applications.  Comprehensively, consumer satisfaction is increased when new goods improve performance, dependability, and usefulness, resulting in a strong brand reputation. Companies that lead in product innovation emerge as industry leaders, generating revenue growth and defining the trajectory of the LTCC substrate market in the US.

Key Players:

• Kyocera provides Low-Temperature Co-Fired Ceramic (LTCC) materials with good performance characteristics for a wide range of packaging applications, such as conductors with low electrical resistance and dielectrics with high flexural strength.
• Murata contributes to the electronics industry expansion by developing new products and solutions in close collaboration with its customers and stakeholders. Murata Manufacturing's LFC® (low-temperature fireable ceramics) substrate, a form of LTCC (low-temperature co-fired ceramics) substrate made from Ag and RuO2 components is one of the company’s most popular products.
• Selmic is a major European producer of packaging methods for electronic modules in high-reliability environments. Module designs combine the company’s clients' applications with Selmic's core technological expertise. Additionally, Selmic's extensive experience with ceramic substrates has been applied to a variety of projects with high-end electronics clients.

Low Temperature Co Fired Ceramic Substrate Market Scope:

 

Report Metric	Details
Market Size Value in 2022	US$8.860 billion
Market Size Value in 2029	US$14.756 billion
Growth Rate	CAGR of 7.56% from 2022 to 2029
Study Period	2019 to 2029
Historical Data	2019 to 2022
Base Year	2023
Forecast Period	2024 – 2029
Forecast Unit (Value)	USD Billion
Segments Covered	Type End-User Industry Geography
Companies Covered	Kyocera Corporation DowDuPont, Inc. TDK Corporation Yokowo Co., Ltd. Spectrum Control
Regions Covered	North America, South America, Europe, Middle East and Africa, Asia Pacific
Customization Scope	Free report customization with purchase

 

Segmentation:

• By Type:
  • RF System Level Package
  • Optoelectronic Package
  • Array Package
  • Others
• By End-User Industry
  • Consumer Electronics
  • Automotive
  • Aerospace and Military
  • Telecommunication
  • Others
• By Geography
  • North America
    • USA
    • Canada          
    • Mexico
  • South America
    • Brazil
    • Argentina
    • Others
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Others
  • Middle East and Africa
    • Saudi Arabia
    • UAE
    • Others
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Taiwan
    • Thailand
    • Indonesia
    • Others

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1. INTRODUCTION

1.1. Market Overview

1.2. Market Definition

1.3. Scope of the Study

1.4. Market Segmentation

1.5. Currency

1.6. Assumptions

1.7. Base and Forecast Years Timeline

1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

2.1. Research Design

2.2. Research Process

3. EXECUTIVE SUMMARY

3.1. Key Findings

4. MARKET DYNAMICS

4.1. Market Drivers

4.2. Market Restraints

4.3. Porter’s Five Forces Analysis

4.3.1. Bargaining Power of Suppliers

4.3.2. Bargaining Power of Buyers

4.3.3. Threat of New Entrants

4.3.4. Threat of Substitutes

4.3.5. Competitive Rivalry in the Industry

4.4. Industry Value Chain Analysis

4.5. Analyst View

5. GLOBAL LOW TEMPERATURE CO FIRED CERAMIC SUBSTRATE MARKET BY TYPE

5.1. Introduction 

5.2. RF System Level Package

5.2.1. Market Trends and Opportunities

5.2.2. Growth Prospects

5.2.3. Geographic Lucrativeness

5.3. Optoelectronic Package

5.3.1. Market Trends and Opportunities

5.3.2. Growth Prospects

5.3.3. Geographic Lucrativeness

5.4. Array Package

5.4.1. Market Trends and Opportunities

5.4.2. Growth Prospects

5.4.3. Geographic Lucrativeness

5.5. Others

5.5.1. Market Trends and Opportunities

5.5.2. Growth Prospects

5.5.3. 5.5.3. Geographic Lucrativeness

6. GLOBAL LOW TEMPERATURE CO FIRED CERAMIC SUBSTRATE MARKET BY END-USER INDUSTRY

6.1. Introduction 

6.2. Consumer Electronics

6.2.1. Market Trends and Opportunities

6.2.2. Growth Prospects

6.2.3. Geographic Lucrativeness

6.3. Automotive

6.3.1. Market Trends and Opportunities

6.3.2. Growth Prospects

6.3.3. Geographic Lucrativeness

6.4. Aerospace and Military

6.4.1. Market Trends and Opportunities

6.4.2. Growth Prospects

6.4.3. Geographic Lucrativeness

6.5. Telecommunication

6.5.1. Market Trends and Opportunities

6.5.2. Growth Prospects

6.5.3. Geographic Lucrativeness

6.6. Others

6.6.1. Market Trends and Opportunities

6.6.2. Growth Prospects

6.6.3. Geographic Lucrativeness

7. GLOBAL LOW TEMPERATURE CO FIRED CERAMIC SUBSTRATE MARKET BY GEOGRAPHY

7.1. Introduction

7.2. North America

7.2.1. By Type

7.2.2. By End-User Industry

7.2.3. By Country

7.2.3.1. United States

7.2.3.1.1. Market Trends and Opportunities

7.2.3.1.2. Growth Prospects

7.2.3.2. Canada

7.2.3.2.1. Market Trends and Opportunities

7.2.3.2.2. Growth Prospects

7.2.3.3. Mexico

7.2.3.3.1. Market Trends and Opportunities

7.2.3.3.2. Growth Prospects

7.3. South America

7.3.1. By Type

7.3.2. By End-User Industry

7.3.3. By Country

7.3.3.1. Brazil

7.3.3.1.1. Market Trends and Opportunities

7.3.3.1.2. Growth Prospects

7.3.3.2. Argentina

7.3.3.2.1. Market Trends and Opportunities

7.3.3.2.2. Growth Prospects

7.3.3.3. Others

7.3.3.3.1. Market Trends and Opportunities

7.3.3.3.2. Growth Prospects

7.4. Europe

7.4.1. By Type

7.4.2. By End-User Industry

7.4.3. By Country

7.4.3.1. Germany

7.4.3.1.1. Market Trends and Opportunities

7.4.3.1.2. Growth Prospects

7.4.3.2. France

7.4.3.2.1. Market Trends and Opportunities

7.4.3.2.2. Growth Prospects

7.4.3.3. United Kingdom

7.4.3.3.1. Market Trends and Opportunities

7.4.3.3.2. Growth Prospects

7.4.3.4. Others

7.4.3.4.1. Market Trends and Opportunities

7.4.3.4.2. Growth Prospects

7.5. Middle East and Africa

7.5.1. By Type

7.5.2. By End-User Industry

7.5.3. By Country

7.5.3.1. Saudi Arabia

7.5.3.1.1. Market Trends and Opportunities

7.5.3.1.2. Growth Prospects

7.5.3.2. Israel

7.5.3.2.1. Market Trends and Opportunities

7.5.3.2.2. Growth Prospects

7.5.3.3. Others

7.5.3.3.1. Market Trends and Opportunities

7.5.3.3.2. Growth Prospects

7.6. Asia Pacific

7.6.1. By Type

7.6.2. By End-User Industry

7.6.3. By Country

7.6.3.1. China

7.6.3.1.1. Market Trends and Opportunities

7.6.3.1.2. Growth Prospects

7.6.3.2. Japan

7.6.3.2.1. Market Trends and Opportunities

7.6.3.2.2. Growth Prospects

7.6.3.3. India

7.6.3.3.1. Market Trends and Opportunities

7.6.3.3.2. Growth Prospects

7.6.3.4. South Korea

7.6.3.4.1. Market Trends and Opportunities

7.6.3.4.2. Growth Prospects

7.6.3.5. Indonesia

7.6.3.5.1. Market Trends and Opportunities

7.6.3.5.2. Growth Prospects

7.6.3.6. Taiwan

7.6.3.6.1. Market Trends and Opportunities

7.6.3.6.2. Growth Prospects

7.6.3.7. Others

7.6.3.7.1. Market Trends and Opportunities

7.6.3.7.2. Growth Prospects

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

8.1. Major Players and Strategy Analysis

8.2. Market Share Analysis

8.3. Mergers, Acquisitions, Agreements, and Collaborations

8.4. Competitive Dashboard

9. COMPANY PROFILES

9.1. Kyocera Corporation

9.2. DowDuPont, Inc.

9.3. Koa Speer Electronics, Inc. (KOA Corporation)

9.4. Murata Manufacturing Co., Ltd.

9.5. Selmic Oy (Mirion Technologies)

9.6. TDK Corporation

9.7. Yokowo Co., Ltd.

9.8. NGK SPARK PLUG CO., LTD. (Niterra Co., Ltd.)

9.9. Orbray Co., Ltd. (Namiki Precision Jewel Co., Ltd.)

9.10. Spectrum Control

Kyocera Corporation

DowDuPont, Inc.

Koa Speer Electronics, Inc. (KOA Corporation)

Murata Manufacturing Co., Ltd.

Selmic Oy (Mirion Technologies)

TDK Corporation

Yokowo Co., Ltd.

NGK SPARK PLUG CO., LTD. (Niterra Co., Ltd.)

Orbray Co., Ltd. (Namiki Precision Jewel Co., Ltd.) 

Spectrum Control